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Semiconductor device having a gate electrode in a grove and a diffused region under the grove

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TLDR
In this article, a power MOSFET with a groove for forming a channel improved for shortening the switching time and increasing the dielectric breakdown strength of the gate oxide film.
Abstract
A power MOSFET having a groove for forming a channel improved for shortening the switching time and increasing the dielectric breakdown strength of the gate oxide film is disclosed. The power MOSFET includes a concave structure in which a gate oxide film at a groove bottom is thickened. Namely, since the gate oxide film between a gate electrode and a first conductivity type semiconductor layer is thick, the capacitance of the oxide film therebetween is reduced. Therefore, the input and output capacitance of the gate oxide film can be reduced, and switching loss can be also reduced since the switching time can be shortened. Further, greater dielectric breakdown strength of the gate oxide film can be obtained as a result of the thickened gate oxide film at the groove bottom.

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Patent

Superjunction Structures for Power Devices and Methods of Manufacture

TL;DR: A power device includes a semiconductor region which in turn includes a plurality of alternately arranged pillars of first and second conductivity type as discussed by the authors, and each of the plurality of pillars of second conductivities type further includes an implant portion filled with semiconductor material.
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TL;DR: Exemplary power semiconductor devices with features providing increased breakdown voltage and other benefits are disclosed in this article, where the authors present a comparison of different types of power semiconductors with different benefits.
References
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Patent

Vertical insulated gate transistor and method of manufacture

TL;DR: In this paper, a vertical insulated gate transistor such as a UMOSFET is manufactured, where a source region of first conductivity type is formed on the bottom surface of a substrate.
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Trench gate structure with thick bottom oxide

TL;DR: Improved trench gate field effect devices are provided by forming a thick oxide at the bottom of the trench as discussed by the authors, which may be preferably formed by ion implantation into the bottom layer of a trench.
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Method for obtaining regions of dielectrically isolated single crystal silicon

TL;DR: In this article, a method of forming single crystal islands by epitaxial growth from a monocrystalline substrate was proposed, where a or other suitable low index surface was preferentially etched to void an inverted pyramid section with or other low index sidewalls.
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Method for setting the threshold voltage of a power mosfet

TL;DR: In this article, a V groove with a flat bottom is anisotropically etched through openings in the oxide layer, which is used to set the threshold voltage of enhancement mode power MOSFETS, without compromising the breakdown voltage.
Patent

V-Mos field effect transistor

TL;DR: In this article, a field effect transistor of the V-MOS type has a layer-shaped first region (3), a subjacent second region (2, 1) of the second conductivity type and an island-shaped zone (4), which is covered with an insulating layer (6) and a gate electrode layer (8).