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Journal ArticleDOI

Submicrometer-Scale Patterning of Ceramic Thin Films

Christopher Robert Martin, +1 more
- 01 Jan 2004 - 
- Vol. 12, Iss: 1, pp 53-68
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TLDR
In this article, a number of low-cost, high throughput techniques for the patterning of ceramic thin films derived from chemical solution precursors, such as sol-gels and ceramic slurries, are presented.
Abstract
The patterning of ceramic thin films is of great interest for use in MEMS and other applications. However, the complex chemistries of certain materials make the use of traditional photolithography techniques prohibitive. In this paper, a number of low-cost, high throughput techniques for the patterning of ceramic thin films derived from chemical solution precursors, such as sol-gels and ceramic slurries, are presented. A particular emphasis is placed on methods that are derived from soft lithographic methods using elastomer molds. Two categories of techniques are discussed: first, the focus is on methods that rely on the principles of confinement within the physical features of the mold to define the pattern on the substrate surface. Then, subtractive patterning techniques that rely on transferring a pattern to a spin-cast, large-area continuous thin film are described. While most techniques have been demonstrated with fidelities on the order of 100 nm, their inability to precisely register and align the patterns as part of a hierarchical fabrication scheme have thus far hindered their commercial implementation.

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Patterning of YVO4:Eu3+ Luminescent Films by Soft Lithography

TL;DR: In this paper, ordered arrays of luminescent YVO4:Eu3+ films with square (side length 19.17 ± 2.05μm) and dot (diameter 11.20 ± 1.82 μm) were fabricated by two kinds of soft lithography processes, namely, microtransfer molding (μTM) and microcontact printing (μCP), respectively.
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Facile Scheme for Fabricating Solid-State Nanostructures Using E-Beam Lithography and Solution Precursors

TL;DR: A facile approach for site-specific fabrication of organic, inorganic, and hybrid solid-state nanostructures through a novel combination of electron-beam lithography and spin coating of liquid and sol-gel precursors, termed soft eBL is demonstrated.
References
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Book ChapterDOI

Mixed mode cracking in layered materials

TL;DR: In this article, the authors describe the mixed mode cracking in layered materials and elaborates some of the basic results on the characterization of crack tip fields and on the specification of interface toughness, showing that cracks in brittle, isotropic, homogeneous materials propagate such that pure mode I conditions are maintained at the crack tip.
Journal ArticleDOI

Imprint Lithography with 25-Nanometer Resolution

TL;DR: In this paper, a high-throughput lithographic method with 25-nanometer resolution and smooth vertical sidewalls is proposed and demonstrated, which uses compression molding to create a thickness contrast pattern in a thin resist film carried on a substrate, followed by anisotropic etching to transfer the pattern through the entire resist thickness.
Journal ArticleDOI

Solid State Ionics

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Inkjet Printing for Materials and Devices

TL;DR: Inkjet printing has been used as a free-form fabrication method for building three-dimensional parts and is being explored as a way of printing electrical and optical devices, especially where these involve organic components.
Journal ArticleDOI

Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol ‘‘ink’’ followed by chemical etching

TL;DR: In this paper, a technique for patterning a self-assembled monolayer (SAM) on a gold substrate using an elastomer stamp was described, followed by selective etching in an aqueous, basic solution of cyanide ion and dissolved dioxygen (1M KOH, 0.1 M KCN).
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