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Surface micromachined solenoid inductors for high frequency applications

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TLDR
In this article, a modified geometry of a solenoid type inductor using a surface micromachining technique is proposed, which has an air core and an electroplated copper coil to reduce the series resistance.
Abstract
As operation frequencies and performance requirements of wireless devices increase, the resultant demands on the performance of passive components also increase. Miniaturization of inductive components for high frequency has been a key research area to address this issue; however, in general, miniaturized integrated inductors can suffer from low Q factors and/or self-resonant frequencies when compared to their discrete counterparts. In this research, a modified geometry of a solenoid type inductor using a surface micromachining technique is proposed. This inductor has an air core and an electroplated copper coil to reduce the series resistance, and its low temperature process is suitable for various packaging applications. An important feature of the proposed inductor geometry is the introduction of an air gap between the substrate and the conductor coil in order to reduce the effects of the substrate dielectric constant. This air gap can be realized using a polyimide sacrificial layer and a surface micromachining technique. Therefore, the resulting inductor can have less substrate-dependent magnetic properties, less stray capacitance, and higher Q-factor. The measurement result shows that this inductor has high Q-factor and stable inductance over a wide range of operating frequency. Also, various effects of geometrical factors have been investigated. Various inductors with the inductance varying from 1 to 20 nH and maximum Q-factor from 7 to 60 have been fabricated and measured.

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Citations
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Journal ArticleDOI

CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs

TL;DR: In this article, a fully CMOS-compatible, highly suspended spiral inductor was designed and fabricated on standard silicon substrates (1/spl sim/30 /spl Omega/spl middot/cm in resistivity) by surface micromachining technology (no substrate etch involved).
Patent

Integrated circuit inductor with a magnetic core

TL;DR: In this article, an inductor is fabricated on a substrate having a top surface and a bottom surface, where a plurality of holes extending through the substrate are used to connect the top and bottom surfaces of the substrate.
Journal ArticleDOI

Surface micromachined solenoid on-Si and on-glass inductors for RF applications

TL;DR: In this paper, the performance of surface micromachined solenoid on-chip inductors fabricated on a standard silicon substrate (10 /spl Omega/spl middot/cm) has been investigated and the results are compared with the same inductors on glass.
Journal ArticleDOI

3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology

TL;DR: In this paper, a new CMOS-compatible versatile thick-metal surface micromachining technology has been developed, which enables to build arbitrary three-dimensional (3-D) metal microstructures on standard silicon substrate as post-IC processes at low temperature below 120/spl deg/C.
Journal ArticleDOI

Development of three-dimensional inductors using plastic deformation magnetic assembly (PDMA)

TL;DR: In this paper, the authors discuss the development of two types of on-chip 3D inductors, a vertical spiral inductor and a solenoid inductor, by using a 3D assembly process called plastic deformation magnetic assembly.
References
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Journal ArticleDOI

Coplanar waveguides and microwave inductors on silicon substrates

TL;DR: In this paper, the authors evaluate the potential of using high-resistivity silicon as a low-cost low-loss microwave substrate through an experimental comparative study and demonstrate that the losses of a coplanar transmission line (CPW) realized on high resistivity (3 k to 7 k /spl Omega/-cm) silicon substrates are comparable to the losses realized on a GaAs substrate covered with insulators.
Journal ArticleDOI

Broad-band monolithic microwave active inductor and its application to miniaturized wide-band amplifiers

TL;DR: In this article, a broadband monolithic microwave active inductor and its characteristics are discussed, which consists of a cascode FET with a feedback resistor, and operates in a much higher frequency range than a spiral inductor.
Journal ArticleDOI

A fully integrated planar toroidal inductor with a micromachined nickel-iron magnetic bar

TL;DR: In this paper, a fully integrated toroidal inductor is realized on a silicon wafer by using a multilevel metallization technique to fabricate a wrapped coil wound around a micromachined bar of high-permeability magnetic material.
Journal ArticleDOI

Analysis of the inductance and the stray capacitance of the dry-etched micro inductors

TL;DR: In this article, the authors examined thin film inductors with meander coils or spiral coils and found that the capacitance between conductor and magnetic film is very significant and needs special consideration.
Journal ArticleDOI

High Frequency Characteristics of a Planar Inductor and a Magnetic Coupling Control Device

TL;DR: In this paper, the high frequency characteristics of a planar inductor, consisting of a meander coil and two magnetic films, was calculated using Neumann's formula and the reluctance method.
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