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The effect of Zn1‐xMgxO buffer layer deposition temperature on Cu(In,Ga)Se2 solar cells: A study of the buffer/absorber interface

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TLDR
In this article, an alternative buffer layer made of (Zn,Mg)O is proposed to replace CdS with cadmium-free, more transparent and environmentally benign alternative buffer layers and to analyze how the material properties of alternative layers affect the solar cell performance.
Abstract
CdS is conventionally used as a buffer layer in Cu(In,Ga)Se2, CIGS, solar cells. The aim of this thesis is to substitute CdS with cadmium-free, more transparent and environmentally benign alternative buffer layers and to analyze how the material properties of alternative layers affect the solar cell performance. The alternative buffer layers have been deposited using Atomic Layer Deposition, ALD. A theoretical explanation for the success of CdS is that its conduction band, Ec, forms a small positive offset with that of CIGS. In one of the studies in this thesis the theory is tested experimentally by changing both the Ec position of the CIGS and of Zn(O,S) buffer layers through changing their gallium and sulfur contents respectively. Surprisingly, the top performing solar cells for all gallium contents have Zn(O,S) buffer layers with the same sulfur content and properties in spite of predicted unfavorable Ec offsets. An explanation is proposed based on observed non-homogenous composition in the buffer layer. This thesis also shows that the solar cell performance is strongly related to the resistivity of alternative buffer layers made of (Zn,Mg)O. A tentative explanation is that a high resistivity reduces the influence of shunt paths at the buffer layer/absorber interface. For devices in operation however, it seems beneficial to induce persistent photoconductivity, by light soaking, which can reduce the effective Ec barrier at the interface and thereby improve the fill factor of the solar cells. Zn-Sn-O is introduced as a new buffer layer in this thesis. The initial studies show that solar cells with Zn-Sn-O buffer layers have comparable performance to the CdS reference devices. While an intrinsic ZnO layer is required for a high reproducibility and performance of solar cells with CdS buffer layers it is shown in this thesis that it can be thinned if Zn(O,S) or omitted if (Zn,Mg)O buffer layers are used instead. As a result, a top conversion efficiency of 18.1 % was achieved with an (Zn,Mg)O buffer layer, a record for a cadmium and sulfur free CIGS solar cell.

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Citations
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Atomic layer deposition for photovoltaics: applications and prospects for solar cell manufacturing

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Nanoengineering and interfacial engineering of photovoltaics by atomic layer deposition

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References
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Journal ArticleDOI

MgxZn1−xO as a II–VI widegap semiconductor alloy

TL;DR: In this article, a wide gap II-VI semiconductor alloy, MgxZn1−xO, was proposed for the fabrication of heteroepitaxial ultraviolet light emitting devices based on ZnO.
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Atomic layer deposition of ZnO transparent conducting oxides

TL;DR: In this paper, a high electron mobility of 30 cm 2 /V·s was obtained for undoped ZnO films with the thickness of only 220 nm and a resistivity of 7.5×10 −4 Ω cm.
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Cu(In,Ga)Se2 solar cells with controlled conduction band offset of window/Cu(In,Ga)Se2 layers

TL;DR: In this article, the authors studied the effects of conduction band offset of window/CIGS layers on CIGS-based solar cell performance and found that the performance of the window layer of Zn1−xMgxO thin film with a controllable band gap was equivalent to that of CdS window layers.
Journal ArticleDOI

Atomic layer deposition of Zn1−xMgxO buffer layers for Cu(In,Ga)Se2 solar cells

TL;DR: In this paper, the shift in the valence and conduction bands of ZnO-S is shown to be nonlinear with respect to the sulfur content, resulting in a large band gap bowing.
Journal ArticleDOI

High resolution XPS studies of Se chemistry of a Cu(In, Ga)Se2 surface

TL;DR: In this paper, a detailed study of the Se signal in CIGS surfaces is presented, and the chemical origin of these signals and the implications for the device processing are discussed.
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