Showing papers on "Residual stress published in 2009"

A three-dimensional finite element analysis of the temperature field during laser melting of metal powders in additive layer manufacturing

Abstract: Simulating the transient temperature field in additive layer manufacturing (ALM) processes has presented a challenge to many researchers in the field. The transient temperature history is vital for determining the thermal stress distribution and residual stress states in ALM-processed parts that utilise a moving laser heat source. The modelling of the problem involving multiple layers is equally of great importance because the thermal interactions of successive layers affect the temperature gradients, which govern the heat transfer and thermal stress development mechanisms. This paper uses an innovative simulation technique known as element birth and death, in modelling the three-dimensional temperature field in multiple layers in a powder bed. The results indicate that the heated regions undergo rapid thermal cycles that could be associated with commensurate thermal stress cycles. Deposition of successive layers and subsequent laser scanning produces temperature spikes in previous layers. The resultant effect is a steady temperature build-up in the lower layers as the number of layers increases.

Investigation of the effect of process parameters on the formation and characteristics of recast layer in wire-EDM of Inconel 718

Abstract: Inconel 718 is a high nickel content superalloy possessing high strength at elevated temperatures and resistance to oxidation and corrosion. The non-traditional manufacturing process of wire-electrical discharge machining (EDM) possesses many advantages over traditional machining during the manufacture of Inconel 718 parts. However, certain detrimental effects are also present and are due in large part to the formation of the recast layer. An experimental investigation was conducted to determine the main EDM parameters which contribute to recast layer formation in Inconel 718. It was found that average recast layer thickness increased primarily with energy per spark, peak discharge current, and current pulse duration. Over the range of parameters tested, the recast layer was observed to be between 5 and 9 μm in average thickness, although highly variable in nature. The recast material was found to possess in-plane tensile residual stresses, as well as lower hardness and elastic modulus than the bulk material.

Thermo-mechanical reliability of 3-D ICs containing through silicon vias

Abstract: In 3-D interconnect structures, process-induced thermal stresses around through-silicon-vias (TSVs) raise serious reliability issues such as Si cracking and performance degradation of devices. In this study, the thermo-mechanical reliability of 3-D interconnect was investigated using finite element analysis (FEA) combined with analytical methods. FEA simulation demonstrated that the thermal stresses in silicon decrease as a function of distance from an isolated TSV and increase with the TSV diameter. Additional simulation suggested that hybrid TSV structures can significantly reduce the thermal stresses. An analytical stress solution was introduced to deduce the stress distribution around an isolated TSV, which was further developed to deduce the stress interaction in TSV arrays based on linear superposition of the analytical solution. We calculated the crack driving force in TSV lines under a thermal load. The effects of TSV diameter, pitch size, and the line configuration on crack driving force were investigated.

Surface integrity characterization and prediction in machining of hardened and difficult-to-machine alloys: a state-of-art research review and analysis

Abstract: This paper presents a review of the state-of-art research on surface integrity characterization, especially the characteristics of residual stresses produced in machining of hardened steels, titanium and nickel-based superalloys using the geometrically defined tools. The interrelationships among residual stresses, microstructures, and tool-wear have been discussed. Current research on residual stress modeling and simulation using finite element method has been critically assessed. Also, the rationale for developing multi-scale simulation models for predicting residual stresses in machining has been presented. At the end, possible future work has been proposed.

Origin of axial prestretch and residual stress in arteries

Abstract: The structural protein elastin endows large arteries with unique biological functionality and mechanical integrity, hence its disorganization, fragmentation, or degradation can have important consequences on the progression and treatment of vascular diseases. There is, therefore, a need in arterial mechanics to move from materially uniform, phenomenological, constitutive relations for the wall to those that account for separate contributions of the primary structural constituents: elastin, fibrillar collagens, smooth muscle, and amorphous matrix. In this paper, we employ a recently proposed constrained mixture model of the arterial wall and show that prestretched elastin contributes significantly to both the retraction of arteries that is observed upon transection and the opening angle that follows the introduction of a radial cut in an unloaded segment. We also show that the transmural distributions of elastin and collagen, compressive stiffness of collagen, and smooth muscle tone play complementary roles. Axial prestresses and residual stresses in arteries contribute to the homeostatic state of stress in vivo as well as adaptations to perturbed loads, disease, or injury. Understanding better the development of and changes in wall stress due to individual extracellular matrix constituents thus promises to provide considerable clinically important insight into arterial health and disease.

Quantifying residual stress in nanoscale thin polymer films via surface wrinkling.

Abstract: Residual stress, a pervasive consequence of solid materials processing, is stress that remains in a material after external forces have been removed. In polymeric materials, residual stress results from processes, such as film formation, that force and then trap polymer chains into nonequilibrium stressed conformations. In solvent-cast films, which are central to a wide range of technologies, residual stress can cause detrimental effects, including microscopic defect formation and macroscopic dimensional changes. Since residual stress is difficult to measure accurately, particularly in nanoscale thin polymer films, it remains a challenge to understand and control. We present here a quantitative method of assessing residual stress in polymer thin films by monitoring the onset of strain-induced wrinkling instabilities. Using this approach, we show that thin (>100 nm) polystyrene films prepared via spin-coating possess residual stresses of approximately 30 MPa, close to the crazing and yield stress. In contrast to conventional stress measurement techniques such as wafer curvature, our technique has the resolution to measure residual stress in films as thin as 25 nm. Furthermore, we measure the dissipation of residual stress through two relaxation mechanisms: thermal annealing and plasticizer addition. In quantifying the amount of residual stress in these films, we find that the residual stress gradually decreases with increasing annealing time and plasticizer amounts. Our robust and simple route to measure residual stress adds a key component to the understanding of polymer thin film behavior and will enable identification of more effective processing routes that mitigate the detrimental effects of residual stress.

Competing grain-boundary- and dislocation-mediated mechanisms in plastic strain recovery in nanocrystalline aluminum

Abstract: Recent experiments have demonstrated that plastic strains in nanocrystalline aluminum and gold films with grain sizes on the order of 50 nm are partially recoverable. To reveal the mechanisms behind such strain recovery, we perform large scale molecular dynamics simulations of plastic deformation in nanocrystalline aluminum with mean grain sizes of 10, 20, and 30 nm. Our results indicate that the inhomogeneous deformation in a polycrystalline environment results in significant residual stresses in the nanocrystals. Upon unloading, these internal residual stresses cause strain recovery via competitive deformation mechanisms including dislocation reverse motion/annihilation and grain-boundary sliding/diffusion. By tracking the evolution of each individual deformation mechanism during strain recovery, we quantify the fractional contributions by grain-boundary and dislocation deformation mechanisms to the overall recovered strain. Our analysis shows that, even under strain rates as high as those in molecular dynamics simulations, grain-boundary-mediated processes play important roles in the deformation of nanocrystalline aluminum.