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Gerald Lucovsky

Researcher at North Carolina State University

Publications -  324
Citations -  10085

Gerald Lucovsky is an academic researcher from North Carolina State University. The author has contributed to research in topics: Dielectric & Thin film. The author has an hindex of 50, co-authored 324 publications receiving 9826 citations. Previous affiliations of Gerald Lucovsky include University of North Carolina at Chapel Hill.

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The effects of interfacial suboxide transition regions on direct tunneling in oxide and stacked oxide-nitride gate dielectrics

TL;DR: In this paper, the effects of interfacial suboxide transition regions at SiO 2 interfaces on tunneling oscillations in the Fowler-Nordheim regime were investigated in the direct tunneling regime.
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Metal gate electrodes for devices with high-k gate dielectrics: Zr/ZrO2 and Hf/HfO2 intrinsic interfacial transition regions

TL;DR: In this paper, a cluster model of the Zr/ZrO"2 interface was embedded in an electrostatic field that simulates more distant Madelung contributions, and removed unphysical solutions as well.

Electronic Structure, Amorphous Morphology and Thermal Stability of Transition Metal Oxide and Chalcogenide Alloys

TL;DR: In this paper, a chemical bonding approach is applied to non-crystalline transition metal oxides and their silicate and aluminate alloys, and new insights into the electronic structure of transition metal chalgogenide alloys are provided.
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Predeposition plasma nitridation process applied to Ge substrates to passivate interfaces between crystalline-Ge substrates and Hf-based high-K dielectrics

TL;DR: In this paper, a novel processing sequence is presented for depositing HfO2 and Hf Si oxynitrides (HFSiON) onto N-passivated Ge(111) and Ge(100), and subsequently removing Ge-N interfacial bonding during 800°C thermal annealing in Ar.
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Oxide formation and passivation for micro- and nano-electronic devices

TL;DR: In this article, a low-temperature remote plasma-assisted oxidation process for interface formation and passivation has been extended from Si and SiC to GaN, which can be applied to nano-scale structures including quantum dots and wires, providing excellent control of ultra-thin interfacial layers which passivate the GaN substrate.