J
Jaw-Jung Shin
Researcher at TSMC
Publications - 43
Citations - 526
Jaw-Jung Shin is an academic researcher from TSMC. The author has contributed to research in topics: Lithography & Resist. The author has an hindex of 13, co-authored 43 publications receiving 524 citations.
Papers
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Patent
New method to reduce CD non-uniformity in IC manufacturing
TL;DR: In this article, a method for reducing Critical Dimension (CD) non-uniformity in creating a patterned layer of semiconductor material is presented. But the method is not suitable for the case of optical proximity effects and microloading.
Patent
Devices and methods for improved reflective electron beam lithography
TL;DR: In this paper, a reflective electron-beam lithography and methods of producing the same are described, which includes a substrate, a plurality of conductive layers formed on the substrate, which are parallel to each other and separated by insulating pillar structures.
Patent
Method and system for a pattern layout split
TL;DR: A method for splitting a pattern layout including providing the pattern layout having features and coloring the features that require splitting with a first and second color, resolving coloring conflicts by decomposing the feature with the coloring conflict.
Proceedings ArticleDOI
Novel 20nm hybrid SOI/bulk CMOS technology with 0.183/spl mu/m/sup 2/ 6T-SRAM cell by immersion lithography
Hou-Yu Chen,Chang-Yun Chang,Chien-Chao Huang,Tang-Xuan Chung,Sheng-Da Liu,Jiunn-Ren HwangYi-Hsuan Liu,Yu-Jun Chou,Hong-Jang Wu,King-Chang Shu,Chung-Kan Huang,Jan-Wen You,Jaw-Jung Shin,Chun-Kuang Chen,Chia-Hui Lin,Ju-Wang Hsu,Bao-Chin Perng,Pang-Yen Tsai,Chi-Chun Chen,Jyu-Horng Shieh,Han-Jan Tao,Shin-Chang Chen,Tsai-Sheng Gau,Fu-Liang Yang +22 more
TL;DR: In this article, a hybrid SOI/bulk CMOS technology with 20nm gate length and low-leakage 1.3nm SiON gate dielectric has been developed for advanced SOC applications.
Proceedings ArticleDOI
A 65nm node strained SOI technology with slim spacer
Fu-Liang Yang,Chien-Chao Huang,Hou-Yu Chen,Jhon-Jhy Liaw,Tang-Xuan Chung,Hung-Wei Chen,Chang-Yun Chang,Cheng Chuan Huang,Kuang-Hsin Chen,Di-Hong Lee,Hsun-Chih Tsao,Cheng-Kuo Wen,Shui-Ming Cheng,Yi-Ming Sheu,Ke-Wei Su,Chi-Chun Chen,Tze-Liang Lee,Shih-Chang Chen,C.H. Chen,Cheng-hung Chang,Jhi-cheng Lu,W. Chang,Chuan-Ping Hou,Ying-Ho Chen,Kuei-Shun Chen,Ming Lu,Li-Wei Kung,Yu-Jun Chou,Fu-Jye Liang,Jan-Wen You,King-Chang Shu,Bin-Chang Chang,Jaw-Jung Shin,Chun-Kuang Chen,Tsai-Sheng Gau,Bor-Wen Chan,Yi-Chun Huang,Han-Jan Tao,J.H. Chen,Yung-Shun Chen,Yee-Chia Yeo,Samuel Fung,Carlos H. Diaz,Chii-Ming Wu,Burn-Jeng Lin,Liang Min-Chang,J.Y.-C. Sun,Chenming Hu +47 more
TL;DR: In this article, a 65 nm node strained SOI technology with high performance is demonstrated, providing drive currents of 1015 and 500 /spl mu/A/A//spl µ/m for N-FETs and P-Fet, respectively, at an off-state leakage of 40 nA/spl μ/m using 1 V operation.