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Journal ArticleDOI

A SiGe Terahertz Heterodyne Imaging Transmitter With 3.3 mW Radiated Power and Fully-Integrated Phase-Locked Loop

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TLDR
To the authors' best knowledge, this work presents the highest radiated power and DC-to-THz radiation efficiency in silicon-based terahertz radiating sources.
Abstract
A high-power 320 GHz transmitter using 130 nm SiGe BiCMOS technology ( $f_{T}/f_{\max} =$ 220/280 GHz) is reported. This transmitter consists of a 4 × 4 array of radiators based on coupled harmonic oscillators. By incorporating a signal filter structure called return-path gap coupler into a differential self-feeding oscillator, the proposed 320 GHz radiator simultaneously maximizes the fundamental oscillation power, harmonic generation, as well as on-chip radiation. To facilitate the TX-RX synchronization of a future terahertz (THz) heterodyne imaging chipset, a fully-integrated phase-locked loop (PLL) is also implemented in the transmitter. Such on-chip phase-locking capability is the first demonstration for all THz radiators in silicon. In the far-field measurement, the total radiated power and EIRP of the chip is 3.3 mW and 22.5 dBm, respectively. The transmitter consumes 610 mW DC power, which leads to a DC-to-THz radiation efficiency of 0.54%. To the authors' best knowledge, this work presents the highest radiated power and DC-to-THz radiation efficiency in silicon-based THz radiating sources.

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Citations
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Terahertz integrated electronic and hybrid electronic–photonic systems

TL;DR: This Review Article examines the development of terahertz integrated electronic and hybrid electronic–photonic systems, considering, in particular, advances that deliver important functionalities for applications in communication, sensing and imaging.
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Terahertz Imaging and Sensing Applications With Silicon-Based Technologies

TL;DR: This paper reviews the progress in THz IC research and investigates several realizations of THz imaging and sensing applications with silicon-based components regarding their motivation, system performance, and challenges.
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An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

TL;DR: AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications, and some recommendations on research topics are presented to further the state of the art of AiP technology.
Posted Content

An Overview of Signal Processing Techniques for Terahertz Communications

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An Overview of Signal Processing Techniques for Terahertz Communications

TL;DR: In this article, the authors provide a comprehensive overview of waveform design and modulation, beamforming and precoding, index modulation, channel estimation, channel coding, and data detection for terahertz (THz)-band communications.
References
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Journal ArticleDOI

Cutting-edge terahertz technology

TL;DR: An overview of the status of the terahertz technology, its uses and its future prospects are presented in this article, with a focus on the use of the waveband in a wide range of applications.
Journal ArticleDOI

A Note on a Simple Transmission Formula

TL;DR: In this paper, a simple transmission formula for a radio circuit is derived, and the utility of the formula is emphasized and its limitations are discussed, as well as its utility and limitations.
Journal ArticleDOI

A Study of Locking Phenomena in Oscillators

R. Adler
TL;DR: In this paper, a differential equation is derived which gives the oscillator phase as a function of time, and with the aid of this equation, the transient process of "pull-in" as well as the production of distorted beat note are described in detail.
Journal ArticleDOI

Terahertz quantum-cascade lasers

TL;DR: In this paper, the state-of-the-art and future prospects for terahertz quantum-cascade laser systems are reviewed, including efforts to increase their operating temperatures, deliver higher output powers and emit longer wavelengths.
Journal ArticleDOI

A study of injection locking and pulling in oscillators

TL;DR: In this paper, an identity obtained from phase and envelope equations is used to express the requisite oscillator nonlinearity and interpret phase noise reduction, and the behavior of phase-locked oscillators under injection pulling is also formulated.
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