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Advanced electronic and optoelectronic materials by Atomic Layer Deposition: An overview with special emphasis on recent progress in processing of high-k dielectrics and other oxide materials

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TLDR
Ninisto et al. as discussed by the authors described the current state of the atomic layer deposition (ALD) technique for producing high-quality thin layers with the focus on oxide materials such as ZrO2 and other rare earth oxides, SnO2, ZnO for high-k dielectrics, gas sensors and various optoelectronic applications.
Abstract
The Feature Article [1] describes the current state of the Atomic Layer Deposition (ALD) technique for producing high-quality thin layers with the focus on oxide materials such as ZrO2 and other rare earth oxides, SnO2 and ZnO for high-k dielectrics, gas sensors and various optoelectronic applications. The cover picture is a photograph of a thin-film-on-silicon sample. The inset schematically illustrates the ALD growth of an oxide film on a surface where L refers to the precursor ligand. The first author, Lauri Niinisto, is Professor of Inorganic Chemistry at Helsinki University of Technology. His current research is focused on the preparation and characterization of thin films for optoelectronic and electronic devices.

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Journal ArticleDOI

Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

TL;DR: In this paper, the surface chemistry of the trimethylaluminum/water ALD process is reviewed, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials.
Journal ArticleDOI

Synthesis and Surface Engineering of Complex Nanostructures by Atomic Layer Deposition

TL;DR: Atomic layer deposition (ALD) has become the method of choice for the semiconductor industry to conformally process extremely thin insulating layers (high-k oxides) onto large-area silicon substrates as discussed by the authors.
Journal ArticleDOI

Monocrystalline spinel nanotube fabrication based on the Kirkendall effect

TL;DR: This letter reports, for the first time, on ultra-long single-crystal ZnAl2O4 spinel nanotubes fabricated through a spinel-forming interfacial solid-state reaction of core-shell ZnO–Al 2O3 nanowires involving the Kirkendall effect.
Patent

Substrate Processing Apparatus

TL;DR: In this article, a bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the booster pump to prevent the exhaust gas from diffusing back to the inside of a process chamber.
References
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Journal ArticleDOI

High-κ gate dielectrics: Current status and materials properties considerations

TL;DR: In this paper, a review of the literature in the area of alternate gate dielectrics is given, based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success.
Journal ArticleDOI

Recent Advances in ZnO Materials and Devices

TL;DR: Wurtzitic ZnO is a widebandgap semiconductor which has many applications, such as piezoelectric transducers, varistors, phosphors, and transparent conducting films as discussed by the authors.
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Ferromagnetism above room temperature in bulk and transparent thin films of Mn-doped ZnO

TL;DR: The first observations of ferromagnetism above room temperature for dilute (<4 at%) Mn-doped ZnO semiconductors are reported, promising new spintronic devices as well as magneto-optic components.
Journal ArticleDOI

Low-Temperature Al2O3 Atomic Layer Deposition

TL;DR: In this article, the properties of low-temperature Al2O3 ALD films were investigated versus growth temperature by depositing films on Si(100) substrates and quartz crystal microbalance (QCM) sensors.
Journal ArticleDOI

Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges†

TL;DR: The self-limiting growth mechanism characteristic to atomic layer deposition (ALD) facilitates the control of film thickness at the atomic level and allows deposition on large and complex surfaces, which makes ALD a very promising technique for future integrated circuits.
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