Journal ArticleDOI
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy
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TLDR
Investigation of the dissolution kinetics of Sn3.5Ag0.5Cu lead-free solder alloy on electrolytic Ni/electroless NiP layer finds that after acquiring certain thickness P-rich Ni layer breaks and increases the diffusion rate of Sn and as a consequence both the IMCs growth rate and dissolution rate also increases.About:
This article is published in Microelectronics Reliability.The article was published on 2003-12-01. It has received 64 citations till now. The article focuses on the topics: Barrier layer & Layer (electronics).read more
Citations
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Journal ArticleDOI
Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder
TL;DR: In this article, the interfacial reactions of Sn-Zn based solders and a Sn-Ag-Cu solder have been compared with a eutectic Sn-Pb solder.
Patent
Cu pillar bump with electrolytic metal sidewall protection
TL;DR: In this paper, a method of forming a bump structure includes providing a semiconductor substrate and forming an under-bumpmetallurgy (UBM) layer on the semiconductor substrategies.
Journal ArticleDOI
Electroless Co–P for diffusion barrier in Pb-free soldering
TL;DR: In this paper, an autocatalytic deposition of cobalt is carried out in hypophosphite containing electrolytes at 95°C and pH 8.5, which is used as a barrier metallization for copper in lead-free soldering.
Journal ArticleDOI
Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures
TL;DR: In this article, the authors analyzed the growth mechanisms of the intermetallic compounds formed at the interfaces of the Sn-Ag-Cu/Co-P joints through multiple reflows.
Journal ArticleDOI
Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints
TL;DR: In this article, the mechanical behaviors and microstructures of the ball grid array (BGA) solder joints against OSP-coated Cu pads on FR4 substrates after multiple reflow process were studied.
References
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Journal ArticleDOI
Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology
TL;DR: In this paper, the authors analyzed the solder reaction-assisted crystallization of electroless Ni-P under bump metallization in the Si/SiO2/Al/Ni-P/63Sn-37Pb multilayer structure using transmission electron microscopy.
Journal ArticleDOI
Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
TL;DR: In this article, the dissolution kinetics of the base metal(s) as well as the growth kinetic of the intermetallics are discussed and the interfacial reactions of Cu and Ni metallizaton with several Pb free and Pb-containing solders are investigated.
Journal ArticleDOI
Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints
Y.C. Chan,A.C.K. So,J.K.L. Lai +2 more
TL;DR: Growth kinetics of interfacial IMC layer and its effect on the shear strength on practical LCCC surface mount solder joints were studied for isothermal aging at 70, 120, 155 and 170°C.
Journal ArticleDOI
Growth kinetics of intermetallic compounds in chip scale package solder joint
TL;DR: In this paper, the Ni-Sn/Cu-Sn IMC layer growth kinetics in the joint soldered on plated Au/Ni FR-4 printed circuit board (PCB) was discussed.
BookDOI
The Electronic Packaging Handbook
TL;DR: The Electronic Packaging Handbook as discussed by the authors provides essential factual information on the design, manufacturing, and testing of electronic devices and systems and is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products.
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