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Journal ArticleDOI

Design of a Miniaturized On-Chip Bandpass Filter Using Edge-Coupled Resonators for Millimeter-Wave Applications

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TLDR
In this article, a unique miniaturization technique for on-chip passive device implemented in gallium arsenide (GaAs)-based technology is presented, which is based on edge-coupled cells (ECCs).
Abstract
A unique miniaturization technique for on-chip passive device implemented in gallium arsenide (GaAs)-based technology is presented, which is based on edge-coupled cells (ECCs). The principle of an ECC is first studied by means of the equivalent LC circuits. Then, using the ECC as a baseline, a combination of different shorting-ground and tapping methods is fully investigated in terms of their impact on frequency responses. By directly shorting the specific edge-coupled fingers to the ground, an ECC can be converted into a resonator without increasing any physical size. To further demonstrate the feasibility of using this technique for miniaturized monolithic microwave integrated circuit design, an on-chip bandpass filter (BPF) is implemented and fabricated in a commercial 0.1- $\mu \text{m}$ GaAs technology. The measurement results show that the 3-dB bandwidth of the filter is from 21.2 to 26.5 GHz, while the insertion loss is less than 2.9 dB at 23 GHz. In addition, more than 30 dB of suppression is achieved from 0 to 15 GHz and from 44 to 54 GHz. The size of the BPF is only $ {640} \times {280}~\mu \text{m}^{{2}}$ , excluding the pads, which is equivalent to ${0.17} \times {0.08} \lambda _{g}^{{2}}$ . ( $\lambda _{g}$ is the guided wavelength at 23.5 GHz.)

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Citations
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Journal ArticleDOI

60-GHz Compact Dual-Mode On-Chip Bandpass Filter Using GaAs Technology

TL;DR: In this paper, a 60 GHz compact dual-mode on-chip bandpass filter (BPF) is presented using gallium arsenide (GaAs) technology. And a prototype of the BPF is fabricated and tested to validate the proposed idea, whose simulated and measured results are in good agreement.
Journal ArticleDOI

Design of an Ultracompact On-Chip Bandpass Filter Using Mutual Coupling Technique

TL;DR: In this paper, the authors proposed an ultracompact bandpass filter (BPF) in GaAs technology without compromising its electrical performance by means of both theoretical analysis and electromagnetic simulation, where the relationship between the external quality factor and the coupling coefficient of the second-order BPF is formulized to better understand the principle of the mutual coupling effect.
Journal ArticleDOI

Compact Microwave and Millimeter-Wave Bandpass Filters Using LTCC-Based Hybrid Lumped and Distributed Resonators

TL;DR: A novel class of low-temperature cofired ceramic bandpass filters (BPFs) is proposed in this paper, featuring of compact size and good filtering responses in both microwave and millimeter-wave bands.
Journal ArticleDOI

Compact cell topology selection for size-reduction-oriented design of microstrip rat-race couplers

TL;DR: The proposed method is validated using 6 different cells with unified parameterization to identify the smallest rectangular‐like rat‐race coupler described by 2 design specifications, and attest that circuit topology and electrical parameters of the reference design are critical factors determining the final miniaturization rate.
Journal ArticleDOI

Microwave On-Chip Bandpass Filter Based on Hybrid Coupling Technique

TL;DR: In this article, a hybrid coupling technique is proposed to generate three transmission zero (TZs) and two transmission poles (TPs) through the hybrid mutual couplings between the inductive and capacitive metals.
References
More filters
Journal ArticleDOI

High-Performance Shielded Coplanar Waveguides for the Design of CMOS 60-GHz Bandpass Filters

TL;DR: In this paper, the authors presented optimized very high performance CMOS slow-wave shielded CPW transmission lines (S-CPW TLines), which were used to realize a 60 GHz bandpass filter, with T-junctions and open stubs.
Journal ArticleDOI

Millimeter-Wave Bandpass Filters by Standard 0.18- $\mu\hbox{m}$ CMOS Technology

TL;DR: In this article, a thin film microstrip (TFMS) structure is properly constructed on the low resistivity silicon substrate, aiming at reducing the substrate loss and crosstalk to a large extent.
Journal ArticleDOI

An On-Chip Bandpass Filter Using a Broadside-Coupled Meander Line Resonator With a Defected-Ground Structure

TL;DR: In this paper, an on-chip bandpass filter (BPF) is designed and fabricated in a 0.13- $\mu \text{m}$ SiGe (Bi)-CMOS technology, which consists of a broadsidecoupled meander-line resonator (BCMLR) in conjunction with a defected ground structure (DGS).
Journal ArticleDOI

A Broadside-Coupled Meander-Line Resonator in 0.13- $\mu \text{m}$ SiGe Technology for Millimeter-Wave Application

TL;DR: In this paper, an on-chip resonator is designed and fabricated using a standard 0.13-μm SiGe technology for millimeter-wave applications, which consists of two broadside-coupled meander lines with opposite orientation.
Journal ArticleDOI

Miniaturized 60-GHz On-Chip Multimode Quasi-Elliptical Bandpass Filter

TL;DR: In this article, a 60 GHz on-chip multimode bandpass filter (BPF) is implemented using a sandwich capacitor, which shows functions of multimode perturbation and stopband control in the BPF design.
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