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Journal ArticleDOI

Direct bonding of high dielectric oxides for high-performance transistor applications

TLDR
In this article, a plasma activation process using a gas mixture of O2/NH3/H2O for direct bonding was developed, which realized the combination of bulk aluminum oxide (Al2O3) and yttria-stabilized cubic zirconia (YSZ) without interlayers for the first time.
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This article is published in Scripta Materialia.The article was published on 2020-03-15. It has received 19 citations till now. The article focuses on the topics: Direct bonding & High-κ dielectric.

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A Review of Bioresorbable Implantable Medical Devices: Materials, Fabrication, and Implementation

TL;DR: Potential bioresorbable materials for each component in an IMD are discussed followed by programmable degradation and safety standards followed by common fabrication methods for bioresponsable materials, along with challenges.
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Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device

TL;DR: In this article, a primary bifunctional device with electrochromic and supercapacitor performance is fabricated by electrochemical polymerizing polyaniline layer onto advanced CuNW@alloy FTEs, which can change colour with different input voltages and store energy simultaneously, demonstrating its potential in next multifunctional flexible electronics.
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Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy

TL;DR: This work develops a sapphire (Al2O3)-based mid-infrared (MIR) hybrid nanofluidic-SEIRA (HN- SEIRA) platform for liquid sensors with the aid of low-temperature interfacial heterogeneoussapphire wafer direct bonding technique, demonstrating a way towards quantitative molecule identification and dynamic analysis for the chemical and biological reaction process.
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Progress of optomechanical micro/nano sensors: a review

TL;DR: Optomechanical sensing based on the coupling between mechanical motions and optical resonances has attracted huge interest in sensor applications due to its small footprint, high sensitivity, low density, and low power.
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Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G.

TL;DR: Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers.
References
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Journal ArticleDOI

FinFET-a self-aligned double-gate MOSFET scalable to 20 nm

TL;DR: In this paper, a self-aligned double-gate MOSFET, FinFET was proposed by using boron-doped Si/sub 04/Ge/sub 06/ as a gate material.
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Recent Developments in p-Type Oxide Semiconductor Materials and Devices.

TL;DR: P-type oxides still lag in performance behind their n-type counterparts, which have entered volume production in the display market, and recent successes along with the hurdles that stand in the way of commercial success of p-type oxide semiconductors are presented.
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Selective hydrogenation of CC bond over N-doped reduced graphene oxides supported Pd catalyst

TL;DR: In this article, N-doped reduced graphene oxides (NRGO) was synthesized via a facile urea-hydrothermal treatment of graphene oxide and used as support for ultrafine Pd nanoparticles (NPs).
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XPS characterization of gel-derived silicon oxycarbide glasses

TL;DR: The results of an XPS study of sol-gel-derived silicon oxycarbide glasses are presented in this paper, where it was shown that the fracture surface is richer in carbon compared with the bulk.
Journal ArticleDOI

XPS and ToF-SIMS study of Sn–Co alloy thin films as anode for lithium ion battery

TL;DR: In this paper, the authors proposed a special fund for Major State Basic Research Project of China (MSBPRP) and NSFC [2009CB220102, CB220002].
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