Patent
Edge termination structure
TLDR
In this article, an edge termination structure is created by forming trench structures (14) near a PN junction, which extends a depletion region between a doped region and a body of semiconductor material or a semiconductor substrate of the opposite conductivity type away from the doped regions.Abstract:
An edge termination structure is created by forming trench structures (14) near a PN junction. The presence of the trench structures (14) extends a depletion region (13) between a doped region (12) and a body of semiconductor material or a semiconductor substrate (11) of the opposite conductivity type away from the doped region (12). This in turn forces junction breakdown to occur in the semiconductor bulk, leading to enhancement of the breakdown voltage of a semiconductor device (10). A surface of the trench structures (14) is covered with a conductive layer (16) which keeps the surface of the trench structures (14) at an equal voltage potential. This creates an equipotential surface across each of the trench structures (14) and forces the depletion region to extend laterally along the surface of semiconductor substrate (11). The conductive layers (16) are electrically isolated from an electrical contact (17) which contacts the doped region (12) and from the conductive layers (16) of neighboring trench structures (14).read more
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Power semiconductor devices and methods of manufacture
Ashok Challa,Alan Elbanhawy,Thomas E. Grebs,Nathan Kraft,Dean E. Probst,Rodney S. Ridley,Steven Sapp,Qi Wang,Chongman Yun,J.G. Lee,Peter H. Wilson,Joseph A. Yedinak,J.Y. Jung,Hocheol Jang,Babak S. Sani,Richard Stokes,Gary M. Dolny,John Mytych,Becky Losee,Adam Selsley,Robert Herrick,James J. Murphy,Gordon K. Madson,Bruce D. Marchant,Christopher L. Rexer,Christopher Boguslaw Kocon,Debra S. Woolsey +26 more
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Patent
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TL;DR: In this paper, a conformal oxide film is used to fill the bottom of a trench formed in a semiconductor substrate and cover a top surface of the substrate, and then the oxide film can be etched off the top surface and inside the trench to leave a substantially flat layer of oxide having a target thickness at bottom of the trench.
References
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Silicon carbide power mosfet with floating field ring and floating field plate
TL;DR: In this paper, the first and second silicon carbide layers are used to form a floating field ring in the termination region of a power MOSFET. But the floating field rings are not used in this paper.
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