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Power semiconductor devices having improved high frequency switching and breakdown characteristics

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TLDR
The use of the trench-based source electrode instead of a larger gate electrode reduces the gate-to-drain capacitance (CGD) of the UMOSFET and improves switching speed by reducing the amount of gate charging and discharging current that is needed during high frequency operation.
Abstract
Integrated power semiconductor devices having improved high frequency switching performance, improved edge termination characteristics and reduced on-state resistance include GD-UMOSFET unit cells with upper trench-based gate electrodes and lower-trench based source electrodes. The use of the trench-based source electrode instead of a larger gate electrode reduces the gate-to-drain capacitance (CGD) of the UMOSFET and improves switching speed by reducing the amount of gate charging and discharging current that is needed during high frequency operation.

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Citations
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Patent

Power semiconductor device

TL;DR: In this paper, a gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell, and a buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode.
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TL;DR: In this article, a high-voltage transistor with a low specific on-state resistance and that supports high voltage in the off-state includes one or more source regions disposed adjacent to a multi-layered extended drain structure which comprises extended drift regions separated from field plate members by one or multiple dielectric layers.
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TL;DR: A power device includes a semiconductor region which in turn includes a plurality of alternately arranged pillars of first and second conductivity type as discussed by the authors, and each of the plurality of pillars of second conductivities type further includes an implant portion filled with semiconductor material.
References
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Vertical field effect transistors having improved breakdown voltage capability and low on-state resistance

TL;DR: In this paper, a power transistor with high breakdown voltage and low on-state resistance includes a vertical field effect transistor in a semiconductor substrate having a plurality of source, channel, drift and drain regions therein.
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Semiconductor devices exhibiting minimum on-resistance

TL;DR: In this article, an improved conductivity vertical channel semiconductor device includes an insulated gate electrode disposed adjacent a substantial portion of the voltage supporting region to reorient the electric field associated with those charges toward the gate electrode and transverse to the direction of current flow through the device.
Patent

Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry

TL;DR: In this article, a power MOSFET was used to suppress voltage breakdown near the gate using a polygon-shaped trench in which the gate was positioned, using a shaped deep body junction that partly lies below the trench bottom, and special procedures for growth of gate oxide at various trench corners.
Patent

Silicon carbide power mosfet with floating field ring and floating field plate

TL;DR: In this paper, the first and second silicon carbide layers are used to form a floating field ring in the termination region of a power MOSFET. But the floating field rings are not used in this paper.
Patent

Schottky barrier rectifier with mos trench

TL;DR: A trench MOS Schottky barrier rectifier as mentioned in this paper includes a semiconductor substrate having first and second faces, a cathode region of first conductivity type at the first face and a drift region on the cathode regions, extending to the second face.
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