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Journal ArticleDOI

Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics

Eun Gyeong Han, +2 more
- 24 Sep 2001 - 
- Vol. 123, Iss: 3, pp 469-476
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TLDR
In order to develop the high quality electromagnetic interference (EMI) shielding textiles for protective clothing, polyester fabrics were electroless copper-plated as discussed by the authors, and the effects of pretreatment conditions such as scouring, etching, and catalyzation on electromagnetic interference shielding effectiveness (EMISE) and physical properties of treated fabrics were investigated.
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This article is published in Synthetic Metals.The article was published on 2001-09-24. It has received 158 citations till now.

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Journal ArticleDOI

Electroless silver coating on glass stitched fabrics for electromagnetic shielding applications

TL;DR: In this article, silver nanoparticles were deposited by electroless coating onto glass-stitched fabrics via the Tollens reaction for technical textile applications, and the effect of fabric compactness a...
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AgNps-PVA–coated woven cotton fabric: Preparation, water repellency, shielding properties and antibacterial activity:

TL;DR: In this paper, electro-conductive woven textiles have been used to provide comfort, safety and protection in the context of smart textiles, and they have different functions, and can provide comfort and safety.
Journal ArticleDOI

Functionalised copper nanoparticle catalysts for electroless copper plating on textiles

TL;DR: In this article, electroless copper plating of a polyester textile was performed using catalysts including a palladium/tin colloid and catalysts based on silver and copper nanoparticles (CuNPs).
Journal ArticleDOI

Comparative Study of Electroless Ni-P, Cu, Ag, and Cu-Ag Plating on Polyamide Fabrics:

TL;DR: In this article, the authors performed electroless plating of Ni-P, Cu, Ag, and Cu-Ag on polyamide fabric and characterized the coating depositions by scanning electron microscope (SEM), energy dispersive X-ray spectroscopy, thermal gravimetric analysis, and Xray diffraction analysis, respectively.
Journal ArticleDOI

Textile design application via electroless copper plating

TL;DR: In this article, the electroless copper plating could change the original appearance of the fabric through the deposition of copper particles on the fabric surface and the final pattern was well-defined using many details such as lines and forms created by the design methods.
References
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Journal ArticleDOI

Plasma Treatment Process for Palladium Chemisorption onto Polymers before Electroless Deposition

TL;DR: In this paper, reaction mechanisms for each of the processes and for each type of surface considered (oxygenated or both oxygenated and nitrogenated by the plasma treatment) are proposed for direct palladium chemisorption onto nitrogenated groups.
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A Study of Immersion Processes of Activating Polished Crystalline Silicon for Autocatalytic Electroless Deposition of Palladium and Other Metals

TL;DR: In this paper, the authors study the effect of modifying the Pd-ammine complex and varying the substrate doping on Pd deposition during activation and Pd AED adhesion and find that the AED of Pd on polished crystalline Si is non-adherent using this activator solution.
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A Mathematical Model for Electroless Copper Deposition on Planar Substrates

TL;DR: In this paper, a mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system.
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