Journal ArticleDOI
Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics
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TLDR
In order to develop the high quality electromagnetic interference (EMI) shielding textiles for protective clothing, polyester fabrics were electroless copper-plated as discussed by the authors, and the effects of pretreatment conditions such as scouring, etching, and catalyzation on electromagnetic interference shielding effectiveness (EMISE) and physical properties of treated fabrics were investigated.About:
This article is published in Synthetic Metals.The article was published on 2001-09-24. It has received 158 citations till now.read more
Citations
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High temperature electromagnetic shielding shape memory polymer composite
TL;DR: In this article, an electromagnetic shielding shape memory polyimide (EMSMPI) was synthesized by incorporating 5% short carbon fiber and 4% carbon black into shape memory matrix.
Journal ArticleDOI
An alternative process for electroless copper plating on polyester fabric
TL;DR: In this article, an electroless Cu plating process on polyester fabrics was modified by replacing the conventional PdCl2 activator with an AgNO3 activator to reduce the overall cost.
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In-situ deposition of Cu2O micro-needles for biologically active textiles and their release properties.
TL;DR: The reducing properties of cellulose were applied to synthesize cuprous oxide in-situ through the direct formation of Cu2O on viscose fabrics via quite simple technique in two subsequent steps: alkalization and sorption.
Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible
TL;DR: In this paper, the authors applied the ligand induced electroless plating (LIEP) process to the patterning of localized metallic tracks via two simple lithographic methods, one based on a standard photolithography process using a positive photoresist masking to prevent the covalent grafting of PAA in designated areas of the polymer substrate.
Journal ArticleDOI
Localized Ligand Induced Electroless Plating (LIEP) Process for the fabrication of copper patterns onto flexible polymer substrates
TL;DR: In this paper, the authors applied the ligand induced electroless plating (LIEP) process to the patterning of localized metallic tracks via two simple lithographic methods, one based on a standard photolithography process using a positive photoresist masking to prevent the covalent grafting of PAA in designated areas of the polymer substrate.
References
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Journal ArticleDOI
Plasma Treatment Process for Palladium Chemisorption onto Polymers before Electroless Deposition
TL;DR: In this paper, reaction mechanisms for each of the processes and for each type of surface considered (oxygenated or both oxygenated and nitrogenated by the plasma treatment) are proposed for direct palladium chemisorption onto nitrogenated groups.
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Generative and Stabilizing Processes in Tin‐Palladium Sols and Palladium Sol Sensitizers
R. L. Cohen,K. W. West +1 more
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A Study of Immersion Processes of Activating Polished Crystalline Silicon for Autocatalytic Electroless Deposition of Palladium and Other Metals
Shreepad Karmalkar,J. Banerjee +1 more
TL;DR: In this paper, the authors study the effect of modifying the Pd-ammine complex and varying the substrate doping on Pd deposition during activation and Pd AED adhesion and find that the AED of Pd on polished crystalline Si is non-adherent using this activator solution.
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A Mathematical Model for Electroless Copper Deposition on Planar Substrates
TL;DR: In this paper, a mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system.