Journal ArticleDOI
Electromagnetic interference shielding effectiveness of electroless Cu-plated PET fabrics
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TLDR
In order to develop the high quality electromagnetic interference (EMI) shielding textiles for protective clothing, polyester fabrics were electroless copper-plated as discussed by the authors, and the effects of pretreatment conditions such as scouring, etching, and catalyzation on electromagnetic interference shielding effectiveness (EMISE) and physical properties of treated fabrics were investigated.About:
This article is published in Synthetic Metals.The article was published on 2001-09-24. It has received 158 citations till now.read more
Citations
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High-performance flexible electromagnetic shielding polyimide fabric prepared by nickel-tungsten-phosphorus electroless plating
TL;DR: In this paper, a functional polyimide (PI) fabric with high electrically conductive and electromagnetic shielding effect was prepared by nickel-tungsten-phosphorus (Ni-W-P) electroless plating.
Journal ArticleDOI
Characteristics of silicon carbide fiber-reinforced composite for microwave absorbing structures
TL;DR: In this article, the mechanical and electromagnetic properties of SiC/epoxy composites, and the performance of microwave-absorbing structures composed of the SiC and epoxy were investigated.
Journal ArticleDOI
Crystallization and annealing effects of sputtered tin alloy films on electromagnetic interference shielding
TL;DR: In this paper, the effect of the crystallization mechanism and film thickness on the electromagnetic interference (EMI) characteristics was investigated for both sputtered and as-sputtered Sn-Al and Sn-Cu thin films after crystallization treatment.
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Electromagnetic shielding efficiency of plasma treated and electroless metal plated polypropylene nonwoven fabrics
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Palladium-free catalytic electroless copper deposition on bamboo fabric: Preparation, morphology and electromagnetic properties
TL;DR: In this article, a copper/bamboo fabric (Cu/BF) composite was obtained by using 3-mercaptopropyltrimethoxysilane (MPTS) before metal deposition.
References
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Journal ArticleDOI
Plasma Treatment Process for Palladium Chemisorption onto Polymers before Electroless Deposition
TL;DR: In this paper, reaction mechanisms for each of the processes and for each type of surface considered (oxygenated or both oxygenated and nitrogenated by the plasma treatment) are proposed for direct palladium chemisorption onto nitrogenated groups.
Journal ArticleDOI
Generative and Stabilizing Processes in Tin‐Palladium Sols and Palladium Sol Sensitizers
R. L. Cohen,K. W. West +1 more
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A Study of Immersion Processes of Activating Polished Crystalline Silicon for Autocatalytic Electroless Deposition of Palladium and Other Metals
Shreepad Karmalkar,J. Banerjee +1 more
TL;DR: In this paper, the authors study the effect of modifying the Pd-ammine complex and varying the substrate doping on Pd deposition during activation and Pd AED adhesion and find that the AED of Pd on polished crystalline Si is non-adherent using this activator solution.
Journal ArticleDOI
A Mathematical Model for Electroless Copper Deposition on Planar Substrates
TL;DR: In this paper, a mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system.