Journal ArticleDOI
Exposure characteristics and three-dimensional profiling of SU8C resist using electron beam lithography
W. H. Wong,E. Y. B. Pun +1 more
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TLDR
In this paper, a new type of chemically amplified resist, SU8C, is evaluated for electron beam lithography, which is a modification of the ultraviolet sensitive negative epoxy SU8.Abstract:
The properties of a new type of chemically amplified resist, SU8C, are evaluated for electron beam lithography. This resist is a modification of the ultraviolet sensitive negative epoxy SU8. Experimental results show that the sensitivity of SU8C is one of the highest among the different kinds of commercially available resists. At 50 keV energy exposure, the saturation dosage of SU8C is ∼3.8 μC/cm2 while that of PMMA is ∼500 μC/cm2. This implies that SU8C resist is suitable for large area exposure. The contrast γ can also be adjusted to near unity by adjusting the postannealing time, and this is essential for multilevel profiling. 16 level steps have been exposed in one electron beam exposure by changing the clock frequency in sequence, and a vertical profile resolution of 20 nm has been achieved. Lines as narrow as 100 nm have been produced, showing that the resist has high resolution down to the nanoscale. Hardness measurements have also been carried out, and SU8C is an order of magnitude harder than epo...read more
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Polymer embossing tools for rapid prototyping of plastic microfluidic devices
TL;DR: In this article, the authors describe a simple and rapid method of fabricating hot embossing tools using polydimethylsiloxane (PDMS), which are then used to rapidly fabricate microchannels in polymethylmethacrylate (PMMA).
Journal ArticleDOI
Review of polymer MEMS micromachining
Brian J. Kim,Ellis Meng +1 more
TL;DR: A broad review of the progress of polymers within MEMS is presented in this paper, including deposition, removal, and release techniques for three widely used MEMS polymer materials, namely SU-8, polyimide, and Parylene C. The application of these techniques to create devices having flexible substrates and novel polymer structural elements for biomedical MEMS (bioMEMS).
Journal ArticleDOI
High-resolution pattern generation using the epoxy novolak SU-8 2000 resist by electron beam lithography
TL;DR: In this paper, the SU-8 2000 resist formulation was used to fabricate high-resolution sub-50 nm patterns by electron beam lithography using epoxy novolak resist formulation and the minimum linewidth achieved is on the order of 30 nm.
Journal ArticleDOI
New developments in through-mask electrochemical micromachining of titanium
P Kern,J Veh,Johann Michler +2 more
TL;DR: In this paper, the shape evolution during diffusion controlled isotropic metal dissolution under circular mask openings of different sizes is in good agreement with numerical simulations, the cavities approaching hemispherical shape before their diameter reaches three times the initial mask opening diameter.
Journal ArticleDOI
Single mode solid state distributed feedback dye laser fabricated by gray scale electron beam lithography on a dye doped SU-8 resist
TL;DR: In this paper, the authors demonstrate gray scale electron beam lithography on a functionalized SU-8 resist for fabrication of single mode solid state dye laser devices, which are well suited for integration into polymer based lab-on-chip circuits for interference based sensing.
References
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Journal ArticleDOI
SU-8: a low-cost negative resist for MEMS
TL;DR: In this paper, the characterization of a home-made negative photoresist developed by IBM is described, called SU-8, which can be produced with commercially available materials and has an outstanding aspect ratio near 15 for lines and 10 for trenches, combined with the electroplating of copper allow the fabrication of highly integrated electromagnetic coils.
Journal ArticleDOI
Micromachining applications of a high resolution ultrathick photoresist
Kam-Leung Lee,Nancy C. LaBianca,S. A. Rishton,S. Zolgharnain,J. D. Gelorme,Jane M. Shaw,Tai-Hon Philip Chang +6 more
TL;DR: In this paper, a negative tone photoresist, SU•8, was proposed for ultrathick layer applications, achieving an aspect ratio of 10:1 using near-ultraviolet lithography in a 200μm-thick layer.
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Phase holograms in polymethyl methacrylate
P. D. Maker,R. E. Muller +1 more
TL;DR: In this paper, complex computer generated phase holograms (CGPHs) have been fabricated in polymethyl methacrylate (PMMA) by partial exposure and subsequent partial development.
Journal ArticleDOI
Deep three‐dimensional microstructure fabrication for infrared binary optics
M. B. Stern,S. S. Medeiros +1 more
TL;DR: Anisotropic reactive ion etching of deep Si structures, planarization of deeply stepped topographies, and multilayer resist processes have been developed for fabrication of silicon IR binary optics devices as discussed by the authors.
Journal ArticleDOI
Reduction and elimination of proximity effects
TL;DR: In this paper, the physical processes limiting resolution and causing proximity effects in electron-beam lithography are outlined, with the major emphasis on sub-250 nm lithography, where a reduction of proximity effects and the enhancement of resolution can be achieved with a thin intermediate layer (such as 50-300 nm of silicon nitride or silicon dioxide) between the resist and the substrate.