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Extensive analysis of the luminescence properties of AlGaN/GaN high electron mobility transistors

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TLDR
In this article, an extensive analysis of the electroluminescence spectra of GaN-based high-electron mobility transistors (HEMT) submitted to different bias regimes is presented.
Abstract
This paper reports on an extensive analysis of the electroluminescence spectra of GaN-based high-electron mobility transistors (HEMT) submitted to different bias regimes. The results described within this paper indicate that: (i) under ON-state bias conditions, HEMT can emit a weak luminescence signal, localized at the edge of the gate toward the drain side; (ii) for low drain voltage levels, the electroluminescence spectrum has a Maxwellian shape, which is typical for hot carrier luminescence; (iii) for high drain voltage levels, parasitic emission bands are generated, possibly due to the recombination of hot electrons through defect-related sites. Electroluminescence data are compared with results of cathodoluminescence measurements, to provide an interpretation for the experimental results.

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Journal ArticleDOI

AlGaN/GaN-Based HEMTs Failure Physics and Reliability: Mechanisms Affecting Gate Edge and Schottky Junction

TL;DR: In this article, a comprehensive review of AlGaN/GaN high electron mobility transistor failure physics and reliability is presented, focusing on mechanisms affecting the gate-drain edge, where maximum electric field and peak temperatures are reached.
Journal ArticleDOI

Time-dependent degradation of AlGaN/GaN high electron mobility transistors under reverse bias

TL;DR: In this article, a detailed analysis of the degradation kinetics of GaN-based high electron mobility transistors submitted to reverse-bias stress is presented, and it is shown that exposure to reverse bias may induce recoverable changes in gate leakage and threshold voltage, due to the accumulation of negative charge within the AlGaN layer, and of positive charge at the GaN/GaN interface.
Journal ArticleDOI

Breakdown mechanisms in AlGaN/GaN HEMTs: An overview

TL;DR: In this article, the physical mechanisms responsible for breakdown current in AlGaN/GaN high electron mobility transistors (HEMTs) were reviewed and compared through a critical comparison between experimental data and previously published results.
Journal ArticleDOI

High current-induced degradation of AlGaN ultraviolet light emitting diodes

TL;DR: In this paper, the degradation of AlGaN quantum well-based light emitting diodes emitting at 285 and 310 nm has been studied using electroluminescence, time-resolved photolumininescence and current-voltage experimental techniques.
Journal ArticleDOI

Degradation of AlGaN/GaN high electron mobility transistors related to hot electrons

TL;DR: In this paper, an extensive analysis of the degradation of AlGaN/GaN high electron mobility transistors (HEMTs) submitted to on-state and off-state stresses is presented.
References
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Journal ArticleDOI

Reliability of GaN High-Electron-Mobility Transistors: State of the Art and Perspectives

TL;DR: In this article, failure modes and mechanisms of AlGaN/GaN high-electron-mobility transistors are reviewed, and data from three de-accelerated tests are presented, which demonstrate a close correlation between failure mode and bias point.
Journal ArticleDOI

Ionization Rates for Electrons and Holes in Silicon

TL;DR: In this article, the ionization rates for holes and electrons in silicon have been determined over the following ranges of field: for holes, (2.5-6.0)\ifmmode\times\else\texttimes\fi{}${10}^{5}$ volts
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Yellow luminescence and related deep states in undoped GaN

TL;DR: In this article, a deep trap that captures photoelectrons from the valence band, after being emptied with photons above 2.5 eV, is proposed as the origin of these features.
Journal ArticleDOI

Field-plate engineering for HFETs

TL;DR: In this paper, the analytical approach for designing field plates for reducing the electric field in the channel and at the surface of heterostructure field effect transistors (HFETs) for a given drain voltage, with the smallest possible increase of the gate capacitance, is presented.
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