Journal ArticleDOI
High- $Q$ Solenoid Inductors With a CMOS-Compatible Concave-Suspending MEMS Process
TLDR
In this paper, the authors presented micromachined solenoid inductors that are fabricated in a standard CMOS silicon substrate (with a resistivity of 1-8 Omega cm) and concavely embedded in a silicon cavity with the silicon wafer surface remaining a plane.Abstract:
This paper presents micromachined solenoid inductors that are fabricated in a standard CMOS silicon substrate (with a resistivity of 1-8 Omega cm) The solenoid is concavely embedded in a silicon cavity with the silicon wafer surface remaining a plane, and mechanically suspended to form an air gap from the bottom of the silicon cavity In addition to facilitating flip-chip packaging, this so-called "concave-suspending" technique effectively depresses the substrate effects including eddy current and capacitive coupling between the coil and the substrate, therefore contributing to both high Q -factor and high resonant frequency of the inductors for high-performance radio-frequency (RF)/microwave integrated circuit applications Various inductors with different solenoid layouts, eg, several shapes of curved solenoids, have been successfully fabricated by using a post-CMOS microelectromechanical systems process that employs copper electroplating, tetra-methyl-ammonium hydroxide (TMAH) + iso- propanol etching and compensation control for convex-corner undercutting, photoresist spray coating, XeF2 gaseous etching, and other steps A lumped circuit model that accounts for inter- turn fringing capacitance, capacitance between the coil and the substrate, substrate ohmic loss and substrate capacitance, etc, is derived for the solenoid inductors The accuracy of the model is confirmed by the testing results and can be used for optimal design of the inductors By S-parameter testing, various types of inductors with different solenoid layouts have been evaluated The solenoid inductors generally exhibit improved RF performance in Q-factor and self-resonance frequency compared to their conventional counterpartsread more
Citations
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Book ChapterDOI
The Design of CMOS Radio-Frequency Integrated Circuits: RF CIRCUITS THROUGH THE AGES
TL;DR: In this paper, an expanded and thoroughly revised edition of Thomas H. Lee's acclaimed guide to the design of gigahertz RF integrated circuits features a completely new chapter on the principles of wireless systems.
Book ChapterDOI
The Modeling, Characterization, and Design of Monolithic Inductors for Silicon RF IC's
TL;DR: In this article, the results of a comprehensive investigation into the characteristics and optimization of inductors fabricated with the top-level metal of a submicron silicon VLSI process are presented.
Journal ArticleDOI
Fully Integrated On-Chip Coil in 0.13 $\mu {\rm m}$ CMOS for Wireless Power Transfer Through Biological Media
Meysam Zargham,P. Glenn Gulak +1 more
TL;DR: This paper presents a 2 × 2.18 mm2 on-chip wireless power transfer (WPT) receiver (Rx) coil fabricated in 0.13 μm CMOS that enables the delivery of milliwatts of power to application circuits while staying below safe power density and electromagnetic exposure limits.
Proceedings ArticleDOI
Silicon-embedded 3D toroidal air-core inductor with through-wafer interconnect for on-chip integration
TL;DR: In this paper, a topologically complex 3D toroidal inductor is fabricated in a deep silicon trench, and is coupled to the wafer surface with high-power, electroplated through-wafer interconnect.
Journal ArticleDOI
RF MEMS Inductors and Their Applications--A Review
TL;DR: This review gives a comprehensive survey on the developments and performances of fixed and variable RF MEMS inductors, and summarizes the best fabrication and tuning approaches inferred from the reviewed works.
References
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Journal Article
The design of CMOS radio-frequency integrated circuits, 2nd edition
TL;DR: This expanded and thoroughly revised edition of Thomas H. Lee's acclaimed guide to the design of gigahertz RF integrated circuits features a completely new chapter on the principles of wireless systems.
Book
The Design of CMOS Radio-Frequency Integrated Circuits
TL;DR: In this article, the authors present an expanded and thoroughly revised edition of Tom Lee's acclaimed guide to the design of gigahertz RF integrated circuits, which is packed with physical insights and design tips, and includes a historical overview of the field in context.
Journal ArticleDOI
Design of Planar Rectangular Microelectronic Inductors
TL;DR: In this paper, the authors derived inductance equations for planar thin- or thick-film coils, comparing equations that include negative mutual inductance with those that do not, and presented a computer program developed for calculating inductances for both square and rectangular geometries, the variables considered being track width, space between tracks, and number of turns.
Journal ArticleDOI
Physical modeling of spiral inductors on silicon
Chik Patrick Yue,S. Simon Wong +1 more
TL;DR: In this article, the authors present a physical model for planar spiral inductors on silicon, which accounts for eddy current effect in the conductor, crossover capacitance between the spiral and center-tap, capacitance in the spiral, substrate ohmic loss, and substrate capacitance.
Journal ArticleDOI
The modeling, characterization, and design of monolithic inductors for silicon RF IC's
J.R. Long,M.A. Copeland +1 more
TL;DR: In this paper, the results of a comprehensive investigation into the characteristics and optimization of inductors fabricated with the top-level metal of a submicron silicon VLSI process are presented.