scispace - formally typeset
Journal ArticleDOI

High Speed and Low Energy Capacitively Driven On-Chip Wires

Reads0
Chats0
TLDR
The capacitor improves delay through signal pre-emphasis, offers a reduced voltage swing on the wire for low energy without a second power supply, and reduces the driven load, allowing for smaller drivers.
Abstract: 
We present circuits for driving long on-chip wires through a series capacitor. The capacitor improves delay through signal pre-emphasis, offers a reduced voltage swing on the wire for low energy without a second power supply, and reduces the driven load, allowing for smaller drivers. Sidewall wire parasitics used as the series capacitor improve process tracking, and twisted and interleaved differential wires reduce both coupled noise as well as Miller-doubled cross-capacitance. Multiple drivers sharing a target wire allow simple FIR filters for driver-side pre-equalization. Receivers require DC bias circuits or DC-balanced data. A testchip in a 180 nm, 1.8 V process compared capacitively-coupled long wires with optimally-repeated full-swing wires. At a 200 mV swing, we measured energy savings of 3.8x over full-swing wires. At a 50 mV swing, we measured energy savings of 10.5x. Throughput on a 14 mm wire experiment due to capacitor pre-emphasis improved 1.7x using a 200 mV swing.

read more

Citations
More filters
Book

On-Chip Networks

TL;DR: Various fundamental aspects of on-chip network design are examined and the reader is provided with an overview of the current state-of-the-art research in this field.
Proceedings ArticleDOI

High-Speed and Low-Energy Capacitively-Driven On-Chip Wires

TL;DR: The capacitor improves delay through signal pre-emphasis, offers a reduced voltage swing on the wire for low energy without a second power supply, and reduces the driven load, allowing for smaller drivers.
Journal ArticleDOI

Low-Power, High-Speed Transceivers for Network-on-Chip Communication

TL;DR: This paper presents a low-power, high-speed source-synchronous link transceiver which enables a factor 3.3 reduction in link power together with an 80% increase in data-rate.
Journal ArticleDOI

Power Efficient Gigabit Communication Over Capacitively Driven RC-Limited On-Chip Interconnects

TL;DR: A set of circuit techniques to achieve high data rate point-to-point communication over long on-chip RC-limited wire-pairs using an s-parameter wire-pair model and shows that a driver with series capacitance and a resistive load are fair approximations of these ideal terminations in the frequency range of interest.
Proceedings ArticleDOI

NoC with Near-Ideal Express Virtual Channels Using Global-Line Communication

TL;DR: A novel NoC with hybrid interconnect that leverages multiple types of interconnects - specifically, conventional full-swing short-range wires for the data path, in conjunction with low-swing, multi-drop wires with long-range, ultra-low-latency communication for the flow control signals.
References
More filters
Journal ArticleDOI

The future of wires

TL;DR: Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays, which is good news since these "local" wires dominate chip wiring.
Journal ArticleDOI

Power distribution system design methodology and capacitor selection for modern CMOS technology

TL;DR: In this paper, the impedance versus frequency profiles of the power distribution system components including the voltage regulator module, bulk decoupling capacitors and high frequency ceramic capacitors are defined and reduced to simulation program with integrated circuit emphasis (SPICE) models.
Journal ArticleDOI

Improved sense-amplifier-based flip-flop: design and measurements

TL;DR: The design and experimental evaluation of a new sense-amplifier-based flip-flop (SAFF) is presented and it is found that the main speed bottleneck of existing SAFF's is the cross-coupled set-reset (SR) latch in the output stage.
Journal ArticleDOI

Transmitter equalization for 4-Gbps signaling

TL;DR: 0.5-micron CMOS transmitter and receiver circuits that use active equalization to overcome the frequency-dependent attenuation of copper lines are developed.
Related Papers (5)