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MonographDOI

Mechanical Behavior of Materials

TLDR
A balanced mechanics-materials approach and coverage of the latest developments in biomaterials and electronic materials, the new edition of this popular text is the most thorough and modern book available for upper-level undergraduate courses on the mechanical behavior of materials as discussed by the authors.
Abstract
A balanced mechanics-materials approach and coverage of the latest developments in biomaterials and electronic materials, the new edition of this popular text is the most thorough and modern book available for upper-level undergraduate courses on the mechanical behavior of materials To ensure that the student gains a thorough understanding the authors present the fundamental mechanisms that operate at micro- and nano-meter level across a wide-range of materials, in a way that is mathematically simple and requires no extensive knowledge of materials This integrated approach provides a conceptual presentation that shows how the microstructure of a material controls its mechanical behavior, and this is reinforced through extensive use of micrographs and illustrations New worked examples and exercises help the student test their understanding Further resources for this title, including lecture slides of select illustrations and solutions for exercises, are available online at wwwcambridgeorg/97800521866758

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Citations
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Journal ArticleDOI

Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders

TL;DR: In this article, the authors investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading using scanning electron microscopy (SEM).
Journal ArticleDOI

Mechanical properties of thin Ag films on a silicon substrate studied using the nanoindentation technique

TL;DR: In this article, the hardness of Ag films was measured using the Oliver-Pharr techniques based on indentation work calculations or on direct measurements of the area of pyramid imprints in AFM images.
Journal ArticleDOI

Flow behavior and microstructure evolution of TB8 alloy during hot deformation process

TL;DR: In this article, a hot compression test of metastable β titanium alloy TB8 was carried out using a Gleeble-1500 thermal simulation testing machine in the temperature range of 750-1 100 °C, at constant strain rate from 0.01 s −1 to 1 s − 1 and with height direction reduction of 60%.
Journal ArticleDOI

Phase Field Benchmark Problems for Dendritic Growth and Linear Elasticity

TL;DR: In this article, the authors present the second set of benchmark problems for phase field models that are being jointly developed by the Center for Hierarchical Materials Design (CHiMaD) and the National Institute of Standards and Technology (NIST), along with input from other members in the phase field community.
Journal ArticleDOI

Atomistic simulation and analysis of plasticity in amorphous silicon

TL;DR: Nabarro et al. as discussed by the authors presented a comprehensive computational simulation of plastic flow in amorphous Si and identified the unit plastic events to consist of discrete shear transformations triggered at characteristic thresholds of stress that result in transformation shear strains of about 0.015.
References
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Book

Theory of Dislocations

TL;DR: Dislocations in Isotropic Continua: Effects of Crystal Structure on Dislocations and Dislocation-Point-Defect Interactions at Finite temperatures.
Book

Cellular Solids: Structure and Properties

TL;DR: The linear elasticity of anisotropic cellular solids is studied in this article. But the authors focus on the design of sandwich panels with foam cores and do not consider the properties of the materials.
Book

Introduction to Ceramics

TL;DR: In this paper, the authors present a model for the development of the MICROSTRUCTURE in CERAMICS based on phase transformation, glass formation and glass-Ceramics.
Book

The stress analysis of cracks handbook

TL;DR: The Stress Analysis of Cracks Handbook as mentioned in this paper provides a comprehensive, easy-to-access collection of elastic stress solutions for crack configurations, along with other relevant information, such as displacements, crack opening areas, basic stress functions source references, accuracy of solutions, and more.
Book

The physics of rubber elasticity

TL;DR: In this paper, the Elasticity of Long-Chain Molecules (LCHs) and Elasticity in a Molecular Network (MNNs) is investigated. But the authors focus on the elasticity of the long chain Molecules.