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Power Integrity Modeling and Design for Semiconductors and Systems
Madhavan Swaminathan,A.E. Engin +1 more
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This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.Abstract:
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systemsread more
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Journal ArticleDOI
Reverse Power Delivery Network for Wireless Power Transfer
Colin Pardue,Anto Kavungal Davis,Mohamed Lamine Faycal Bellaredj,Mohammad Faisal Amir,Saibal Mukhopadhyay,Madhavan Swaminathan +5 more
TL;DR: This letter proposes an innovative solution for this problem, by demonstrating a new design method called a reverse power distribution network (PDN), a concept originating from the conventional processor PDN design.
Journal ArticleDOI
Pinwheel Meander-Perforated Plane Structure for Mitigating Power/Ground Noise in System-in-Package
TL;DR: In this paper, a pinwheel perforated plane (PMPP) structure is proposed for small electromagnetic bandgap structure that is suitable to be integrated into system-in-package.
Proceedings ArticleDOI
Pre-layout power integrity analysis in the design flow of a PCB
Raul Fizesan,Dan Pitica +1 more
TL;DR: In this article, a Matlab tool is developed to identify problems prior to the final layout of a power distribution network, which can be used to identify the design flaws arising due to parasitic effects.
Proceedings ArticleDOI
Circuit models for power/ground planes on PCBs using SPICE method
Raul Fizesan,Dan Pitica +1 more
TL;DR: In this article, the same numerical approach based on FDM is used to analyze power/ground planes, but the power structure will be modeled using SPICE programs, and the power planes of arbitrary shape can be modeled efficiently both in the time-domain and frequency domain.