scispace - formally typeset
Open AccessBook

Power Integrity Modeling and Design for Semiconductors and Systems

Reads0
Chats0
TLDR
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Abstract
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systems

read more

Citations
More filters
Proceedings ArticleDOI

Signal-power integrity co-simulations of high speed systems via chip-package-PCB co-analysis methodology

TL;DR: In this article, a modeling method considering all the significant effects from the chip, package, and board levels is developed to identify and investigate the critical nets affecting the signal or power integrity (SI/PI).
Proceedings ArticleDOI

At-Product-Test Dedicated Adaptive supply-resonance suppression

TL;DR: This paper presents an adaptive supply-resonance (SR) suppression scheme at a product testing stage, dedicated to each product in different assembly forms, and the feasibility has been silicon-proven by a prototype demonstration in 0.18μm CMOS successfully.
Journal ArticleDOI

Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

TL;DR: In this paper, an approach for power integrity analysis on multi-layer printed circuit boards is presented, where inductance decomposition is applied to identify the critical parameters that can influence the PDN input impedance.
Journal ArticleDOI

An Arnoldi Algorithm for Power-Delivery Networks With Variable Dielectric Constant and Loss Tangent

TL;DR: This paper presents a more accurate approach based on the block Arnoldi algorithm to calculate the change in the PDN impedance due to a variation in the dielectric constant, loss tangent, or both.
Journal ArticleDOI

A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair

TL;DR: In this paper, the modeling of single via and differential vias in single plane pair and multilayer is completed using this method, and the results are consistent with the simulation results of HFSS within 9 GHz.
Related Papers (5)