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Power Integrity Modeling and Design for Semiconductors and Systems

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TLDR
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Abstract
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systems

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Proceedings ArticleDOI

The use of buried technology in microsystem packaging achieves the new type of electronic band gap

TL;DR: In this article, a two-dimensional EBG structure is proposed to suppress the simultaneous switching noise of electronic systems, based on the inductance enhanced by the development of the micro system substrate embedded technology in recent years in the long-linemetal between adjacent unit cell, which is achieved by the units lattice structure, made of the connection of a square metal and two metal serpentine lines.
Proceedings ArticleDOI

Feasibility of uncertainty quantification for power distribution network modeling using PCE and a contour integral method

TL;DR: This combination of methods represents the first application of CIM and PCE to the modeling of PDNs and the PCE is found to be numerically more efficient than Monte Carlo in cases where parameters are varied that have an influence on the parallel plate impedance.
Journal ArticleDOI

Power distribution network design with split and merged power rails

TL;DR: A study on power rails merger option is carried out based on two aspects: the load current characteristics and the power noise tolerances of the functional blocks being merged.
Journal ArticleDOI

Systematic Design of Bandstop Power Distribution Network Using Resonant Vias

TL;DR: In this paper, a systematic design method is proposed to achieve the optimal design of bandstop power delivery network (PDN) using resonant vias in a multilayered printed circuit board (PCB).
Proceedings ArticleDOI

The development of electric coupling for RF IC package substrate

TL;DR: In this article, noises being from two structure of package substrate are discussed, and some suggestions are provided to obtain suppression of noises in order to obtain the suppression of the noises in RF transceiver signals.
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