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Power Integrity Modeling and Design for Semiconductors and Systems

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TLDR
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Abstract
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systems

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Design, simulation and analysis of embedded Uni-planar compact electromagnetic band-gap structure

TL;DR: The design, simulation, analysis and application of embedded Uni-planar compact electromagnetic band-gap structure for high speed digital circuit or mixed circuit application and the results show that the E-UC-EBG can achieve better SI and EMC characteristic if designed properly.
Proceedings ArticleDOI

Investigation and correlation study for board-level multi-GHz interconnects with non-ideal return paths

TL;DR: In this paper, the authors tackle three different design issues related to return paths: multiple layer transitions, split reference planes, and stitching vias between planes using a commercially available 3D tool.
Proceedings ArticleDOI

A Quick Assessment of Nonlinearity in Power Delivery Networks

TL;DR: A close matching is seen between the results obtained by proposed and conventional methods with a significant speedup reported.
Journal ArticleDOI

High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)

TL;DR: In this article, a regression noise model that can cover the noise effect from N-coupled TSVs based on SPICE simulation and reliability analysis flow for high-level simulation using high level noise models is proposed.
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