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Power Integrity Modeling and Design for Semiconductors and Systems
Madhavan Swaminathan,A.E. Engin +1 more
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This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.Abstract:
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systemsread more
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Proceedings ArticleDOI
Power distribution network modeling for 3-D ICs with TSV arrays
TL;DR: The CNIM model is validated by comparing its results to the one obtained from a full-wave simulator and the differences between two approaches are within 5% but the computation time is shorter than that required by aFullwave simulator.
Proceedings ArticleDOI
Signal Integrity Analysis on High-Density Silicon Interposer Package Technology for Next Generation Applications
Surender Singh,Ashish Gupta +1 more
TL;DR: This paper investigates the SI application of a fine-line, fine-pitch, large-size silicon interposer technology for integrating a processor and high-bandwidth memory (HBM) and the results seen are compared to traditional PoP technology.
Journal ArticleDOI
Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design
TL;DR: The CDML framework consists of a context-based meta learner and collaborative distillation scheme to produce a reusable solver that outperforms both neural baselines and iterative conventional design methods in terms of real-world objective, power integrity, with zero-shot transfer-ability.