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Power Integrity Modeling and Design for Semiconductors and Systems
Madhavan Swaminathan,A.E. Engin +1 more
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TLDR
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.Abstract:
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systemsread more
Citations
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Journal ArticleDOI
Analysis of power supply noise in AMS circuits including the effects of interconnects using estimation by inspection method
TL;DR: The estimation-by-inspection method is extended to analyze the performance metrics of the AMS circuits and a speed-up factor of 9 has been achieved using the proposed method as compared to the EDA simulations.
Proceedings ArticleDOI
Equivalent circuit model extraction for interconnects in 3D ICs
TL;DR: A methodology to extract parasitic RC models from such simulation data for interconnects in a 3D IC is described.
Proceedings ArticleDOI
A preliminary analysis of domain coupling in package power distribution network
Byoungjin Bae,Seungwon Kim,Youngmin Kim,Seokhyeong Kang,Il Joon Kim,Kwang-Seok Kim,Sun-Won Kang,Ki Jin Han +7 more
TL;DR: In this paper, the coupling of power domains in a typical package power distribution network (PDN) was investigated, mainly focusing on the effect of ground structures and substrate parameters, and the self and the coupling capacitances were calculated.
Proceedings ArticleDOI
Comprehensive design considerations in die-package-board transceiver channel co-simulation
TL;DR: In this paper, the authors focus on a design methodology that can translate package/board transceiver channel loss, cross talk and power supply noise into system jitter degradation, which is a significant factor in the design of almost all communications links such as PCI Express, Ethernet, XAUI, Interlaken etc.