scispace - formally typeset
Open AccessBook

Power Integrity Modeling and Design for Semiconductors and Systems

Reads0
Chats0
TLDR
This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Abstract
The First Comprehensive, Example-Rich Guide to Power Integrity ModelingProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the artUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noiseThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applicationsThe authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists It will also be valuable to developers building software that helps to analyze high-speed systems

read more

Citations
More filters
Proceedings ArticleDOI

Minimizing simultaneous switching noise at reduced power with power transmission lines for high-speed signaling

TL;DR: In this paper, a new power delivery scheme is shown to significantly reduce switching noise at lower power by replacing the power plane structure with a power transmission line (PTL), which has been demonstrated through theory, simulation, and measurements.
Proceedings ArticleDOI

Parameterized PI SPICE platforms for AC and time-domain simulations

Raul Fizesan, +1 more
TL;DR: In this article, the authors introduce different parameterized PI SPICE platforms, based on the finite difference method that helps a PI engineer to analyze a PDN in both frequency and time domain.
Journal ArticleDOI

Orthogonal rational approximation of transfer functions for high‐frequency circuits

TL;DR: The orthogonal rational approximation (ORA) as mentioned in this paper algorithm for rational function approximation of transfer functions, based on data available from simulations or measurements, allows integration of such data in transient solvers for analysis of high-frequency circuits.
Proceedings ArticleDOI

Distributed decoupling analysis on PG planes for PDN design

TL;DR: In this article, a method to get the distributed characteristic of impedance and the locations of decoupling capacitors on power-ground (PG) planes for minimizing the impedance design is presented.
Proceedings ArticleDOI

A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions

TL;DR: In this article, a BGA package design exhibiting resonance conditions in insertion loss is analyzed, which led to ground path issues caused by return current density congestions, and an improvement in ground return path layout led to elimination of resonance conditions.
Related Papers (5)