Journal ArticleDOI
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
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This article is published in Journal of Electronic Packaging.The article was published on 2013-12-01. It has received 5 citations till now. The article focuses on the topics: Reliability (statistics) & Taguchi methods.read more
Citations
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Journal ArticleDOI
A critical review of constitutive models for solders in electronic packaging
Gang Chen,Xiaochen Zhao,Hao Wu +2 more
TL;DR: In this article, the failure of the solder joints is attributed to the failure due to the defect of the soldering process of the joints. But due to their superior electrical, thermal, and mechanical properties, solder joints are the most widely used interconnection materials in electronic product packaging.
Journal ArticleDOI
Reliability study of package-on-package stacking assembly under vibration loading
TL;DR: The vibration reliability of lead-free solder joints of Package-on-Package (PoP) is investigated by experimental tests and finite element method (FEM) simulations in this paper and results show that the higher the bottom solder joints' standoff, the more difficult the failure for the PoP assembly.
Journal ArticleDOI
The stress analysis and parametric studies for the low-k layers of a chip in the flip-chip process
TL;DR: A three-dimensional sub-modeling finite element approach considering an effective layer for the back end of line (BEOL) microstructures in the global model to improve the accuracy is proposed and the optimal combination of the factors was achieved.
Proceedings ArticleDOI
Effect of viscoelastic behavior of EMC on predicting QFN fatigue life
TL;DR: In this paper, the tensile tests based on Dynamic Mechanical Analyzer (DMA) experiment are employed to investigate the viscoelastic behavior of a commercial EMC material.
Journal ArticleDOI
Bidens-Inspired Anchor-Locking Microstructure for Improving the Reliability of Advanced Quad Flat No-Lead Packages
Wei-Chih Lin,Yu-Lung Huang +1 more
TL;DR: In this paper, an anchor-locking microstructure approach was developed to enhance the bonding strength of the leadframe and epoxy molding compound (EMC) in advanced quad flat no-lead (aQFN) packages.
References
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Proceedings ArticleDOI
Effect of simulation methodology on solder joint crack growth correlation
TL;DR: In this paper, the crack initiation and growth constants are recalculated using ANSYS/sup TM/5.2 finite element code used in the model and several other model related issues are explored with respect to the crack growth correlations.
Journal ArticleDOI
Constitutive equations for hot-working of metals
TL;DR: In this paper, a set of phenomenological, internal variable type constitutive equations describing the elevated temperature deformation of metals is developed, which can faithfully account for strain-hardening, the restoration processes of recovery and recrystallization and strain rate and temperature history effects.
Journal ArticleDOI
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
TL;DR: In this article, a method is described which provides estimates to first order of the number of either power or envirionmenta1 cyc1es 1eading to so1der joint fai1ure.
Journal ArticleDOI
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
TL;DR: Comparing the induced inelastic strains in the solder joint, the leadfree SnAgCu generally scores better thanks to the lower creep strain rate, while for the CSP and flip chip package, SnAg Cu scores worse for the more extreme loading conditions when the inelastically dissipated energy density is selected as damage parameter.
Journal ArticleDOI
Prediction of stress-strain relationship with an improved Anand constitutive Model For lead-free solder Sn-3.5Ag
Xu Chen,Gang Chen,Masao Sakane +2 more
TL;DR: In this article, an improved Anand constitutive model is proposed to describe the inelastic deformation of lead-free solder Sn-3.5Ag used in solder joints of microelectronic packaging.