Journal ArticleDOI
SU8-Silver Photosensitive Nanocomposite
TLDR
In this article, percolation and conductivity of photoresist polymers were investigated using LMIS4-ARTICLE-2004-011, which is the Web of Science Record created on 2005-09-13.Abstract:
Keywords: percolation ; conductivity ; photoresist ; polymer ; mems Reference LMIS4-ARTICLE-2004-011doi:10.1002/adem.200400068View record in Web of Science Record created on 2005-09-13, modified on 2017-05-10read more
Citations
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Journal ArticleDOI
SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
A. del Campo,Christian Greiner +1 more
TL;DR: The SU-8 photoresist has become the favourite photoreist for high-aspect-ratio (HAR) and three-dimensional (3D) lithographic patterning due to its excellent coating, planarization and processing properties as well as its mechanical and chemical stability as mentioned in this paper.
Journal ArticleDOI
Polymer-Nanoparticle Composites: From Synthesis to Modern Applications
TL;DR: The addition of inorganic spherical nanoparticles to polymers allows the modification of the polymers physical properties as well as the implementation of new features in the polymer matrix as mentioned in this paper, and typical existing and potential applications are shown with the focus on new and innovative applications, like in energy storage systems.
Journal ArticleDOI
Cantilever-like micromechanical sensors
TL;DR: In this article, the basic modes of operation in cantilever-like micromechanical sensors and optical and electrical means for signal transduction are discussed with focus on silicon-and polymer-based technologies.
Journal ArticleDOI
Microcantilevers: Sensing Chemical Interactions via Mechanical Motion
TL;DR: This work highlights the importance of knowing the carrier and removal status of these materials before, during, and after the construction of the coatings.
Journal ArticleDOI
SU-8 as a structural material for labs-on-chips and microelectromechanical systems.
TL;DR: Different SU‐8‐based techniques have led to new low‐temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab‐on‐chip.
Related Papers (5)
SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
A. del Campo,Christian Greiner +1 more