Journal ArticleDOI
Substrate effect on electrodeposited copper morphology and crystal shapes
TLDR
In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.Abstract:
Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.read more
Citations
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Journal ArticleDOI
Estimation of Zwitterionic Surfactant Response in Electroless Composite Coating and Properties of Ni–P–CuO (Nano)Coating
R. Muraliraja,R. Muraliraja,J. Sudagar,R. Elansezhian,A. V. Raviprakash,R. Dhinakaran,V.S. Shaisundaram,M. Chandrasekaran +7 more
TL;DR: In this article, Zwitterionic surfactant was introduced into the composite coating for the first time to increase the suspension of nanoparticles effectively during the coating process, which reduced the intermolecular attraction between the solid and liquid interfaces and eliminated the binding of the nanoparticles with the hydrogen gas bubbles.
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Properties and applications of amphoteric surfactant: A concise review
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Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review
TL;DR: In this article, the authors compared the properties of copper-based antimicrobial coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition, and sputtering techniques.
Journal ArticleDOI
Electrochemical approaches for selective recovery of critical elements in hydrometallurgical processes of complex feedstocks.
TL;DR: In this review, recent advances in electrochemically mediated technologies for metal recovery are discussed, with a focus on rare earth elements and other key critical materials for the modern circular economy.
Journal ArticleDOI
Synthesis and characterization of novel Cu, Cu-SiC functionally graded coating by pulse reverse electrodeposition
TL;DR: In this paper, a Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route.
References
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Journal ArticleDOI
Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes
TL;DR: In this paper, the electrodeposition of copper from non-cyanide electrolytes using glycerol as complexing agent in an alkaline medium in the presence of gelatin, anisaldehyde, imidazole and peptone as additives was investigated.
Journal ArticleDOI
Active sites of heterogeneous nucleation understood as chemical reaction sites
TL;DR: The role of active sites in heterogeneous nucleation can be understood on the basis of chemical thermodynamics as chemical reaction sites as discussed by the authors, where the basic assumption is the formation of a chemical bond between the atoms (or molecules) of the nuclei with the atoms of the active site.
Journal ArticleDOI
Effect of Current Density on the Nucleation and Growth of Crystal Facets during Pulse Electrodeposition of Sn–Cu Lead-Free Solder
TL;DR: In this article, the changes in morphology in a Sn matrix during pulsed electrodeposition of a Sn-Cu near-eutectic alloy with varying current density in an acidic electrolyte are highlighted.
Journal ArticleDOI
On the kinetics of copper electroless plating with hypophosphite reductant
J. I. Martins,M. C. Nunes +1 more
TL;DR: In this article, the electroless copper plating using sodium hypophosphite as the reductant and sodium citrate as the chelating agent was studied by gravimetric and electrochemical measurements.
Book ChapterDOI
United Kingdom (UK)
TL;DR: The United Kingdom is divided into four parts: Northern Ireland, Scotland, Wales and England as discussed by the authors and 80 % of the population in the UK is located in England and this is also reflected in the context of higher education.