Journal ArticleDOI
Substrate effect on electrodeposited copper morphology and crystal shapes
TLDR
In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.Abstract:
Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.read more
Citations
More filters
Journal ArticleDOI
Estimation of Zwitterionic Surfactant Response in Electroless Composite Coating and Properties of Ni–P–CuO (Nano)Coating
R. Muraliraja,R. Muraliraja,J. Sudagar,R. Elansezhian,A. V. Raviprakash,R. Dhinakaran,V.S. Shaisundaram,M. Chandrasekaran +7 more
TL;DR: In this article, Zwitterionic surfactant was introduced into the composite coating for the first time to increase the suspension of nanoparticles effectively during the coating process, which reduced the intermolecular attraction between the solid and liquid interfaces and eliminated the binding of the nanoparticles with the hydrogen gas bubbles.
Journal ArticleDOI
Properties and applications of amphoteric surfactant: A concise review
Journal ArticleDOI
Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review
TL;DR: In this article, the authors compared the properties of copper-based antimicrobial coatings produced by various deposition methods including thermal spray technique, electrodeposition, electroless plating, chemical vapor deposition (CVD), physical vapor deposition, and sputtering techniques.
Journal ArticleDOI
Electrochemical approaches for selective recovery of critical elements in hydrometallurgical processes of complex feedstocks.
TL;DR: In this review, recent advances in electrochemically mediated technologies for metal recovery are discussed, with a focus on rare earth elements and other key critical materials for the modern circular economy.
Journal ArticleDOI
Synthesis and characterization of novel Cu, Cu-SiC functionally graded coating by pulse reverse electrodeposition
TL;DR: In this paper, a Cu based functionally graded coating (FGC) has been deposited on an annealed Cu substrate by galvanostatic pulse reverse electrodeposition (PRED) route.
References
More filters
Journal ArticleDOI
Nucleation and growth of copper under combined charge transfer and diffusion limitations—Part II
TL;DR: In this article, the nucleation and growth of copper crystals on a glassy carbon electrode are studied under potentiostatic conditions and current transients are recorded at different overpotentials.
Journal ArticleDOI
Influence of Chloride Anions on the Mechanism of Copper Electrodeposition from Acidic Sulfate Electrolytes
TL;DR: In this article, the influence of chloride Cl - ions in a broad range of chloride concentrations on the kinetics and mechanism of copper electrodeposition from sulfate-based acidic electrolytes was investigated.
Journal ArticleDOI
A Study on the Effect of Pulse Electrodeposition Parameters on the Morphology of Pure Tin Coatings
TL;DR: In this article, the effects of various electroplating parameters such as current density, additive concentration, duty cycle, frequency, pH, and stirring rate (bath rotation) on the evolution of surface morphology of the coatings have been studied.
Journal ArticleDOI
Corrosion of copper-coated steel high level nuclear waste containers under permanent disposal conditions
Thalia E. Standish,J. Chen,Rebecca Jacklin,Pellumb Jakupi,S. Ramamurthy,Dmitrij Zagidulin,Peter G. Keech,David W. Shoesmith +7 more
TL;DR: In this paper, the surface corrosion of cold sprayed and electrodeposited coatings generally exhibited similar corrosion behaviour to standard wrought copper, most likely as a consequence of the damage inflicted during the deposition process.
Journal ArticleDOI
Electrodeposition: A Technology for the Future
TL;DR: In this paper, the authors give a brief and incomplete overview of electrodeposition, but they hope at least to whet your appetite to learn more about the process at an atomic level.