Journal ArticleDOI
Substrate effect on electrodeposited copper morphology and crystal shapes
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In this paper, the surface morphology varies with the change in overpotential, but not with change in substrate, and the crystal shape is independent of the applied over-potential but varies with bath chemistry or choice of substrate.Abstract:
Copper has been electrodeposited on copper (FCC) and mild steel (BCC) substrates from acidic sulphate bath with and without cetyl trimethyl ammonium bromide at 0.25, 2, 6 and 9 V. It is found that the surface morphology varies with the change in overpotential, but not with the change in substrate. On the contrary, the crystal shape is found to be independent of the applied overpotential, but varies with the bath chemistry or choice of substrate.read more
Citations
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Estimation of Zwitterionic Surfactant Response in Electroless Composite Coating and Properties of Ni–P–CuO (Nano)Coating
R. Muraliraja,R. Muraliraja,J. Sudagar,R. Elansezhian,A. V. Raviprakash,R. Dhinakaran,V.S. Shaisundaram,M. Chandrasekaran +7 more
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Properties and applications of amphoteric surfactant: A concise review
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Electrochemical approaches for selective recovery of critical elements in hydrometallurgical processes of complex feedstocks.
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References
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Journal ArticleDOI
Pulse-reverse electrodeposition of Cu–SiC nanocomposite coating: Effect of concentration of SiC in the electrolyte
TL;DR: In this article, the effect of different concentrations of nano SiC particles in the electrolyte on codeposition and hence on the properties of the composites have been studied both in absence and in the presence of three different types of surfactant (anionic, cationic and nonionic).
Structural Accelerating Effect of Chloride On Copper Electrodeposition
Yuriy I. Yanson,M. J. Rost +1 more
TL;DR: Under the microscope: In situ, video-rate scanning-tunneling-microscopy imaging during Cu electrodeposition reveals a profound structural accelerating effect of Cl(-) on the deposition process.
Journal ArticleDOI
Effect of thiourea on grain refinement and defect structure of the pulsed electrodeposited nanocrystalline copper
K. Shravan Kumar,Krishanu Biswas +1 more
TL;DR: In this article, an extensive study on the grain refinement and the defect structure in the pulsed electrodeposited nanocrystalline copper was conducted. But the results indicated formation of nanocrystine copper grains by even small addition of thiourea with three orders of magnitude reduction in the grain size as compared to the sample deposited without thourea.
Journal ArticleDOI
Effect of current density during electrodeposition on microstructure and hardness of textured Cu coating in the application of antimicrobial Al touch surface.
TL;DR: TEM analysis reveals the presence of nano-twins in the film deposited at higher current density, which contributed to a large extent to the sharp increase of coating hardness compared to the mechanism of Hall-Petch effect.
Journal ArticleDOI
Equilibrium shapes of supported silver clusters
Slavica Stankic,Slavica Stankic,Robinson Cortes-Huerto,Robinson Cortes-Huerto,Nicoleta Crivat,Nicoleta Crivat,Dominique Demaille,Dominique Demaille,Jacek Goniakowski,Jacek Goniakowski,Jacques Jupille,Jacques Jupille +11 more
TL;DR: The morphology of silver nanoparticles supported on MgO smoke crystallites was studied by combining Transmission Electron Microscopy (TEM) and atomistic simulations of clusters of realistic size and showed that the formers were close to equilibrium.