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Journal ArticleDOI

The Effect of Different Dielectric Materials in Designing High-Performance Metal-Insulator-Metal (MIM) Capacitors

TLDR
In this article, the effect of different dielectric constants (k ) to the performance of the MIM capacitors is also studied, whereas this work investigates the effect that using low- k and high- k dielectrics materials.
Abstract
A Metal-Insulator-Metal (MIM) capacitor with high capacitance, high breakdown voltage, and low leakage current is aspired so that the device can be applied in many electronic applications. The most significant factors that affect the MIM capacitor’s performance is the design and the dielectric materials used. In this study, MIM capacitors are simulated using different dielectric materials and different number of dielectric layers from two layers up to seven layers.  The effect of the different dielectric constants ( k ) to the performance of the MIM capacitors is also studied, whereas this work investigates the effect of using low- k and high- k dielectric materials. The dielectric materials used in this study with high- k are Al 2 O 3 and HfO 2 , while the low- k dielectric materials are SiO 2 and Si 3 N 4 . The results demonstrate that the dielectric materials with high- k produce the highest capacitance. Results also show that metal-Al 2 O 3 interfaces increase the performance of the MIM capacitors. By increasing the number of dielectric layers to seven stacks, the capacitance and breakdown voltage reach its highest value at 0.39 nF and 240 V, respectively.

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Citations
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Journal ArticleDOI

Dielectric properties investigation of a compound based on atomic layer deposited multi-layer structure

TL;DR: In this paper, the authors investigated the dielectric properties of hafnium oxide (HfOx), aluminum oxide (AlOx), tantalum oxide (TaOx) and HfAlTaOx compound based on their multilayer structure.
Journal ArticleDOI

Interfacial Permittivity Characterization of Heterogeneous Dielectric Bi-Layers

TL;DR: Extensive experimental measurements of the capacitances of interdigitated electrode (IDE) devices are used to excite heterogenous dielectric interfaces with electric fields that are parallel to the planes of those interfaces, enabling the authors to estimate the volumetric average of this component of polarizability.
Proceedings ArticleDOI

Simulation of Inkjet Printed MIMCAP for Flexible Electronics Application

TL;DR: In this paper , the metal-insulator-metal capacitance (MIMCAP) was designed using alternative material by optimizing the device structure design, and analyzed the electronic performance of the designed MIMCAP.
Proceedings ArticleDOI

Simulation of Inkjet Printed MIMCAP for Flexible Electronics Application

TL;DR: In this article , the metal-insulator-metal capacitance (MIMCAP) was designed and analyzed using COMSOL multiphysics simulation tools, where the output capacitance was mainly observed, including the gap between the metal and insulator, dimension, design structure, and the number of the layer.
References
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Journal ArticleDOI

High-κ gate dielectrics: Current status and materials properties considerations

TL;DR: In this paper, a review of the literature in the area of alternate gate dielectrics is given, based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success.
Journal ArticleDOI

Analog characteristics of metal-insulator-metal capacitors using PECVD nitride dielectrics

TL;DR: In this paper, the frequency dependence of PECVD nitride and LPCVD oxide metal-insulator-metal (MIM) capacitors is investigated with special attention for precision analog applications.
Journal ArticleDOI

Ultrahigh Capacitance Density for Multiple ALD-Grown MIM Capacitor Stacks in 3-D Silicon

TL;DR: In this paper, an atomic-layer deposition (ALD) was used to achieve an ultra-high capacitance density of 440 at a breakdown voltage VDB > 6 V on a silicon substrate containing high-aspect-ratio macropore arrays.
Journal ArticleDOI

A high performance MIM capacitor using HfO 2 dielectrics

TL;DR: In this article, a 56 nm thick HfO/sub 2/ high-/spl kappa/ dielectric film was fabricated and demonstrated for the first time with a low thermal budget (/spl sim/200/spl deg/C).
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