Journal ArticleDOI
Thermal Design of Immersion Cooling Modules for Electronic Components
TLDR
In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.Abstract:
Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.read more
Citations
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DESIGN OF A CANDIDATE THERMAL CONTROL SYSTEM FOR A CRYOGENICALLY-COOLED COMPUTER Complete manuscript reviewed
TL;DR: In this paper, the thermal aspects of an immersion-cooled computer designed to operate at cryogenic temperatures are discussed, including the selection of a working fluid, determination of the mode, or modes, of heat transfer to be employed, and selection, or development, of any required heat transfer correlations.
Book ChapterDOI
Plasma Techniques for the Fabrication of Hydrophobic Substrates
TL;DR: The state of the art on the subject has been scrutinized based on basic concepts of hydrophobic substrates, and methods and materials for fabricating hydrophilic substrates by plasma processing are discussed in this article .
Proceedings ArticleDOI
Flow and heat transfer characteristics of a natural circulation liquid cooling system for electronic components
Hiroshi Honda,Jinjia Wei +1 more
TL;DR: In this article , the authors studied the flow and heat transfer characteristics of a natural circulation cooling system for electronic components, which consisted of a test section, a horizontal evaporator, a vertical tube, horizontal condenser, a rubber bag attached at the exit of condenser and a downcomer.
References
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Journal ArticleDOI
Condensation heat transfer in the presence of noncondensables, interfacial resistance, superheating, variable properties, and diffusion
TL;DR: In this article, a wide-ranging analytical investigation of laminar film condensation is presented, which includes interfacial resistance, superheating, free convection due to both temperature and concentration gradients, mass diffusion and thermal diffusion, and variable properties in both the liquid and the gas-vapor regions.
Journal ArticleDOI
Laminar film condensation on the underside of horizontal and inclined surfaces
Joseph Gerstmann,Peter Griffith +1 more
TL;DR: In this paper, heat transfer rates in laminar film condensation on the underside of horizontal and inclined surfaces are predicted by assuming the condensate flow to be the quasi-steady result of a bounded instability.
Journal ArticleDOI
Critical heat flux of saturated natural convection boiling in a space bounded by two horizontal co-axial disks and heated from below
Yoshiro Katto,Y. Kosho +1 more