Journal ArticleDOI
Thermal Design of Immersion Cooling Modules for Electronic Components
TLDR
In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.Abstract:
Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.read more
Citations
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Journal ArticleDOI
Heat transfer in cooling systems of microelectronic equipment with partially submerged condensers
TL;DR: In this article, the authors used inert dielectric liquid MDSF as a working fluid to reduce the influence of non-condensable gas on heat transfer at the vapor space condenser.
Journal ArticleDOI
Immersion Cooling of Electronics in Fluidized Beds of Dielectric Particles
Robert C. Brown,Scott S. Jasper +1 more
TL;DR: In this article, the authors investigated fluidized beds of dielectric particles as a heat transfer medium for cooling electronic equipment and found that the heat dissipation from a simulated 20-pin flat pack in this fluidized environment was a factor of eight greater than forced convection without particles.
Journal ArticleDOI
Fundamental research on convective heat transfer in electronic cooling technology
TL;DR: In this article, the authors provide a review and summary of the programs with emphasis on direct liquid cooling with respect to the following cooling modes: liquid free, mixed and forced convection, liquid jet impingement, flowing liquid film cooling, pool boiling, spray cooling, foreign gas jet impeding in liquid pool, and forcing convection air-cooling.
Journal ArticleDOI
An experiment on thermosyphon boiling in uniformly heated vertical tube and asymmetrically heated vertical channel
TL;DR: In this paper, an experimental investigation of thermosyphonic boiling in vertical tube and channel made by two parallel rectangular plates was carried out for possible application of the direct immersion cooling.
Book ChapterDOI
Thermal Control for Cryogenically Cooled Computer Systems
TL;DR: In this article, the authors summarized the work that has been done at the University of Tennessee on the development of thermal control systems for computers designed to operate at cryogenic temperatures and discussed a number of the major thermal design issues.
References
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Journal ArticleDOI
Condensation heat transfer in the presence of noncondensables, interfacial resistance, superheating, variable properties, and diffusion
TL;DR: In this article, a wide-ranging analytical investigation of laminar film condensation is presented, which includes interfacial resistance, superheating, free convection due to both temperature and concentration gradients, mass diffusion and thermal diffusion, and variable properties in both the liquid and the gas-vapor regions.
Journal ArticleDOI
Laminar film condensation on the underside of horizontal and inclined surfaces
Joseph Gerstmann,Peter Griffith +1 more
TL;DR: In this paper, heat transfer rates in laminar film condensation on the underside of horizontal and inclined surfaces are predicted by assuming the condensate flow to be the quasi-steady result of a bounded instability.
Journal ArticleDOI
Critical heat flux of saturated natural convection boiling in a space bounded by two horizontal co-axial disks and heated from below
Yoshiro Katto,Y. Kosho +1 more