Thermal modeling for 3D-ICs with integrated microchannel cooling

TLDR: A fast and accurate thermal-wake aware thermal model for integrated microchannel 3D ICs, which achieves more than 400× speed up and only 2.0% error in comparison with a commercial numerical simulation tool is presented.

Abstract: Integrated microchannel liquid-cooling technology is envisioned as a viable solution to alleviate an increasing thermal stress imposed by 3D stacked ICs Thermal modeling for microchannel cooling is challenging due to its complicated thermal-wake effect, a localized temperature wake phenomenon downstream of a heated source in the flow This paper presents a fast and accurate thermal-wake aware thermal model for integrated microchannel 3D ICs Validation results show the proposed thermal model achieves more than 400x speed up and only 20% error in comparison with a commercial numerical simulation tool We also demonstrate the use of the proposed thermal model for thermal optimization during the IC placement stage We find that due to the thermal-wake effect, tiles are placed in the descending order of power magnitude along the flow direction We also find that modeling thermal-wakes is critical for generating a thermal-aware placement for integrated microchannel-cooled 3D IC It could result in up to 25˚C peak temperature difference according to our experiments Categories and Subject Descriptors B72 [Integrated Circuits]: Design Aids General Terms Design, Performance