Q
Qi Liu
Researcher at Fudan University
Publications - 494
Citations - 16543
Qi Liu is an academic researcher from Fudan University. The author has contributed to research in topics: Resistive random-access memory & Neuromorphic engineering. The author has an hindex of 55, co-authored 433 publications receiving 11785 citations. Previous affiliations of Qi Liu include Chinese Academy of Sciences & Anhui University.
Papers
More filters
Journal ArticleDOI
Phycocyanin attenuates X-ray-induced pulmonary inflammation via the TLR2-MyD88-NF-κB signaling pathway
TL;DR: Data indicated that PC attenuated lung infl ammatory damage induced by radiation by blocking the TLR2- MyD88-NF-κB signaling pathway, suggesting that PC could be a protective agent against radiation-induced infl amMatory damage in normal tissues.
Patent
Resistive random access memory device with rectification characteristic and manufacturing method thereof
TL;DR: In this paper, a resistive random access memory with a rectification characteristic and a manufacturing method of the resistive Random Access Memory (RAAM) was presented. But the authors did not reveal the manufacturing procedure of the RAM.
Journal ArticleDOI
A palladium-catalyzed approach to allenic aromatic ethers and first total synthesis of terricollene A
Chaofan Huang,Fuchun Shi,Yifan Cui,Can Li,Jie Lin,Qi Liu,Anni Qin,Huanan Wang,Guolin Wu,Penglin Wu,Junzhe Xiao,Haibo Xu,Yuan Yuan,Yizhan Zhai,Wei-Feng Zheng,Yangguangyan Zheng,Biao Yu,Shengming Ma,Shengming Ma +18 more
TL;DR: A palladium-catalyzed C–O bond formation reaction between phenols and allenylic carbonates to give 2,3-allenic aromatic ethers with decent to excellent yields under mild reaction conditions has been described.
Journal ArticleDOI
Scalability of Sulfur‐Based Ovonic Threshold Selectors for 3D Stackable Memory Applications
Patent
Method for reducing Reset current of RRAM (resistive random access memory) device
TL;DR: In this paper, a thermal protective layer is inserted between the bottom electrode and the resistive memory layer, and/or between the resistor memory layer and the top electrode, and used for reducing the heat loss of the RRAM device in the transition process from the low impedance state to the high impedance state.