S
S. Beaurepaire
Researcher at University of Grenoble
Publications - 3
Citations - 102
S. Beaurepaire is an academic researcher from University of Grenoble. The author has contributed to research in topics: Back end of line & Order (ring theory). The author has an hindex of 3, co-authored 3 publications receiving 71 citations.
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Proceedings ArticleDOI
3D Sequential Integration: Application-driven technological achievements and guidelines
Perrine Batude,Laurent Brunet,C. Fenouillet-Beranger,Francois Andrieu,J.-P. Colinge,Didier Lattard,E. Vianello,Sebastien Thuries,O. Billoint,Pascal Vivet,Cristiano Santos,B. Mathieu,Benoit Sklenard,C.-M. V. Lu,J. Micout,F. Deprat,E. Avelar Mercado,F. Ponthenier,N. Rambal,M.-P. Samson,M. Casse,Sebastien Hentz,Julien Arcamone,Gilles Sicard,Louis Hutin,L. Pasini,A. Ayres,O. Rozeau,R. Berthelon,Fabrice Nemouchi,Philippe Rodriguez,J.-B. Pin,D. Larmagnac,A. Duboust,V. Ripoche,S. Barraud,N. Allouti,Sébastien Barnola,C. Vizioz,J.M. Hartmann,Sebastien Kerdiles,P. Acosta Alba,S. Beaurepaire,V. Beugin,F. Fournel,Pascal Besson,Virginie Loup,R. Gassilloud,François Martin,X. Garros,Frédéric Mazen,Bernard Previtali,C. Euvrard-Colnat,V. Balan,C. Comboroure,M. Zussy,Mazzocchi,O. Faynot,M. Vinet +58 more
TL;DR: 3D Sequential Integration with ultra-small 3D contact pitch with Ultra-Low TB FETs has potential for low-power applications and allow for the stacking of multiple layers.
Proceedings ArticleDOI
Breakthroughs in 3D Sequential technology
Laurent Brunet,C. Fenouillet-Beranger,Perrine Batude,S. Beaurepaire,F. Ponthenier,N. Rambal,V. Mazzocchi,J-B. Pin,P. Acosta-Alba,Sebastien Kerdiles,Pascal Besson,H. Fontaine,T. Lardin,F. Fournel,V. Larrey,F. Mazen,V. Balan,Christophe Morales,C. Guerin,Vincent Jousseaume,Xavier Federspiel,D. Ney,X. Garros,A. Roman,Daniel Scevola,P. Perreau,F. Kouemeni-Tchouake,Lucile Arnaud,C. Scibetta,S. Chevalliez,F. Aussenac,J. Aubin,Shay Reboh,Francois Andrieu,Sylvain Maitrejean,M. Vinet +35 more
TL;DR: In this article, the authors present breakthrough in six areas that were previously considered as potential showstoppers for 3D sequential integration from either a manufacturability, reliability, performance or cost point of view.
Proceedings ArticleDOI
Guidelines for intermediate back end of line (BEOL) for 3D sequential integration
Claire Fenouillet-Beranger,S. Beaurepaire,F. Deprat,A. Ayres de Sousa,Laurent Brunet,Perrine Batude,Olivier Rozeau,Francois Andrieu,P. Besombes,M.-P. Samson,Bernard Previtali,Fabrice Nemouchi,Guillaume Rodriguez,Philippe Rodriguez,R. Famulok,N. Rambal,V. Balan,Zineb Saghi,Vincent Jousseaume,C. Guerin,F. Ibars,F. Proud,D. Nouguier,D. Ney,Vincent Delaye,H. Dansas,Xavier Federspiel,Maud Vinet +27 more
TL;DR: For the first time the thermal stability of a new fluorine-free (F-free) W barrier coupled with W interconnections enabling 22% line 1 resistance improvement is evaluated in view of 3D VLSI integration.