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Samuel Suhard

Researcher at Katholieke Universiteit Leuven

Publications -  44
Citations -  293

Samuel Suhard is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Wafer & Wafer bonding. The author has an hindex of 7, co-authored 43 publications receiving 218 citations. Previous affiliations of Samuel Suhard include IMEC.

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3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects

TL;DR: In this paper, a bumpless process is introduced in order to further scale down the pitch of microbumps, and electrical resistance measurement, cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.