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Journal ArticleDOI

An Analytical Model of the Forward I– V Characteristics of 4H-SiC p-i-n Diodes Valid for a Wide Range of Temperature and Current

TLDR
In this article, the forward I-V characteristics of 4H-SiC p-i-n diodes are studied in a wide range of currents and temperatures by means of an analytical model that allows us to highlight the minority current contributions in various diode regions, namely, the highly doped regions, the neutral base, and the space charge layer.
Abstract
The forward I-V characteristics of 4H-SiC p-i-n diodes are studied in a wide range of currents and temperatures by means of an analytical model that allows us to highlight the minority current contributions in various diode regions, namely, the highly doped regions, the neutral base, and the space charge layer. By accounting for the doping dependence of various physical parameters, such as bandgap narrowing, incomplete doping activation, carrier lifetime, and mobility, the model turns useful to investigate the role of various material properties at different current levels and temperatures. The accuracy of the model is verified by comparisons with numerical simulations and experimental data in a wide range of currents and temperatures, so that this model turns very useful for better understanding the impact of technological parameters on the steady-state behavior of diodes and obtaining an accurate circuital model of diodes.

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Citations
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Journal ArticleDOI

Modeling of Wide-Bandgap Power Semiconductor Devices—Part II

TL;DR: Part I reviewed compact models for silicon carbide (SiC) power diodes and MOSFETs and part II completes the review of SiC devices and covers gallium nitride devices as well.
Journal ArticleDOI

Improved Modeling of Medium Voltage SiC MOSFET Within Wide Temperature Range

TL;DR: An improved model of medium voltage (1200 V) silicon carbide (SiC) MOSFET based on PSpice is proposed in this paper, which is suitable for wide temperature range applications especially at low temperature.
Journal ArticleDOI

4H-SiC p-i-n diode as Highly Linear Temperature Sensor

TL;DR: In this paper, the linear dependence on temperature of the voltage drop across a forward-biased 4H-SiC p-i-n diode was investigated experimentally, and the results showed that the fabricated temperature sensor has a high degree of linearity in the range from room temperature up to 573 K corresponding to a root-mean-square error lower than 0.5%.
Journal ArticleDOI

Modeling Inductive Switching Characteristics of High-Speed Buffer Layer IGBT

TL;DR: In this article, a physics-based compact model for high-speed buffer layer insulated gate bipolar transistor (IGBT) is proposed, which utilizes the 1-D Fourier-based solution of ambipolar diffusion equation (ADE) implemented in MATLAB and Simulink.
Journal ArticleDOI

Numerical simulations of the electrical transport characteristics of a Pt/n-GaN Schottky diode

TL;DR: In this paper, the effect of different defect states within the n-GaN bulk with different densities and spatial locations is considered, and the authors show that the diode ideality factor and threshold voltage decrease with increasing temperature, while at the same time, the zero-bias Schottky barrier height (Φb0) extracted from the forward current density-voltage (J-V) characteristics increases.
References
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Journal ArticleDOI

Carrier Generation and Recombination in P-N Junctions and P-N Junction Characteristics

TL;DR: In this article, the authors show that the current due to generation and recombination of carriers from generation-recombination centers in the space charge region of a p-n junction accounts for the observed characteristics.
BookDOI

Fundamentals of Power Semiconductor Devices

TL;DR: In this article, the fundamental physics of power semiconductor devices are discussed and an analytical model for explaining the operation of all power Semiconductor devices is presented, focusing on silicon devices.
Journal ArticleDOI

SiC devices: physics and numerical simulation

TL;DR: In this article, the important material parameters for 6H silicon carbide (6H-SiC) are extracted from the literature and implemented into the 2D device simulation programs PISCES and BREAKDOWN and into the 1-D program OSSI Simulations of 6HSiC p-n junctions show the possibility to operate corresponding devices at temperatures up to 1000 K thanks to their low reverse current densities.
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