Journal ArticleDOI
Application of phase change materials for passive thermal control of plastic quad flat packages (PQFP): a computational study
D. Pal,Yogendra Joshi +1 more
- Vol. 30, Iss: 1, pp 19-34
TLDR
In this paper, a transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB).Abstract:
A transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB). Governing conservation equations for mass, momentum and energy were solved by an implicit finite volume numerical technique. The effects of phase change were modelled by a single domain enthalpy-porosity technique. To study the effects of thermal conductivity of the board, a total of four cases were considered with two different board materials. It was found that passive cooling with PCM can arrest the temperature rise for a substantial time, for the power level considered. A higher board thermal conductivity resulted in a reduction in temperature levels. The melt region for a lower thermal conductivity of the board was found to be localized near the package footprint, while, for a higher board conductivity, the melt region extends along the board.read more
Citations
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Phase Change Materials for Low Temperature Solar Thermal Applications
TL;DR: In this article, the authors make an effort to gather the information from the previous works on PCMs and latent heat storage systems and provide a list of about 250 PCM and more than 220 references.
Journal ArticleDOI
The Experimental Exploration of Embedding Phase Change Materials With Graphite Nanofibers for the Thermal Management of Electronics
TL;DR: Krishnan et al. as discussed by the authors investigated the use of graphite nano-bers suspended within the PCM to increase thermal performance without significantly increasing module weight or size.
Journal ArticleDOI
Analysis of a phase change energy storage system for pulsed power dissipation
TL;DR: In this article, the melting of phase change material in a container of rectangular cross-section with multiple discrete heat sources mounted on one side is investigated for electronics cooling by latent heat energy storage.
Journal ArticleDOI
Effects of melting temperature and the presence of internal fins on the performance of a phase change material (PCM)-based heat sink
Li-Wu Fan,Yu-Qi Xiao,Yi Zeng,Xin Fang,Xiao Wang,Xu Xu,Zi-Tao Yu,Ronghua Hong,Ya-Cai Hu,Kefa Cen +9 more
TL;DR: In this paper, the effects of melting temperature and the presence of internal fins on the performance of a phase change material (PCM)-based heat sink for thermal management of electronics were investigated.
Journal ArticleDOI
Phase change material based cooling of photovoltaic panel: A simplified numerical model for the optimization of the phase change material layer and general economic evaluation
TL;DR: In this article, a simplified numerical model was developed to be able to analyze the expected efficiency improvement of a PV-PCM system as well as the expected reduction of the PV panel's operating temperature.
References
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Book
Numerical heat transfer and fluid flow
TL;DR: In this article, the authors focus on heat and mass transfer, fluid flow, chemical reaction, and other related processes that occur in engineering equipment, the natural environment, and living organisms.
Journal ArticleDOI
Enthalpy-porosity technique for modeling convection-diffusion phase change: application to the melting of a pure metal
TL;DR: In this article, the melting of pure gallium in a rectangular cavity has been numerically investigated using the enthalpy-porosity approach for modeling combined convection-diffusion phase change.
Proceedings ArticleDOI
Thermal modelling of the Pentium processor package
H.I. Rosten,Ram S. Viswanath +1 more
TL;DR: In this article, a component manufacturer and a thermal analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) are presented.
ReportDOI
An investigation of using a phase-change material to improve the heat transfer in a small electronic module for an airborne radar application
TL;DR: In this article, the energy equation is formulated in terms of enthalpy and discretized using a finite-difference method, which can be used to analyze heat conduction in a rectangular region undergoing an isothermal phase change.