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Journal ArticleDOI

Application of phase change materials for passive thermal control of plastic quad flat packages (PQFP): a computational study

D. Pal, +1 more
- Vol. 30, Iss: 1, pp 19-34
TLDR
In this paper, a transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB).
Abstract
A transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB). Governing conservation equations for mass, momentum and energy were solved by an implicit finite volume numerical technique. The effects of phase change were modelled by a single domain enthalpy-porosity technique. To study the effects of thermal conductivity of the board, a total of four cases were considered with two different board materials. It was found that passive cooling with PCM can arrest the temperature rise for a substantial time, for the power level considered. A higher board thermal conductivity resulted in a reduction in temperature levels. The melt region for a lower thermal conductivity of the board was found to be localized near the package footprint, while, for a higher board conductivity, the melt region extends along the board.

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Citations
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Proceedings ArticleDOI

Cooling management of a protruding electronic components by using a phase change material heat sink

TL;DR: The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips.
Journal ArticleDOI

Étude numérique de la fusion dans des enceintes rectangulaires chauffées uniformément ou discrètement par les parois latérales conductrices

TL;DR: In this paper, a numerical study has been conducted for natural convection dominated melting inside uniformly and discretely heated rectangular cavities, and a computational methodology based on the enthalpy method for the phase change is first presented and validated with experimental data.
Journal ArticleDOI

The accurate diffusive model for predicting the vapor pressure of phase change materials by thermogravimetric analysis

TL;DR: In this paper, three different approaches to estimate the vapor pressure by thermogravimetric analyses (TGA) of commercial paraffins-based phase change materials (PCMs) have been compared The known Langmuir vaporization relation and two additional models based on the mass transfer by molecular diffusion at isothermal and non-isothermal conditions, using the Fuller equation for estimating binary diffusion coefficients in the gas phase, were developed.
Journal ArticleDOI

Experiments on thermal characteristics of a natural circulation loop with latent heat energy storage under cyclic pulsed heat load

TL;DR: In this paper, the authors made an experimental investigation of thermal characteristics of a rectangular, annular single-phase natural circulation loop with the inner tube filled with a solid-liquid phase change material (PCM) under cyclic pulsating heat load.
Journal ArticleDOI

Design of Thermal Initial and Boundary Conditions to Control the Expansion of Water-Based Phase-Change Materials in Low Gravity

TL;DR: In this paper, a passive carrier employing water-based phase-change materials is designed to return temperature-critical payloads from the International Space Station, which can cause rupture of freezers and/or an inability to fit inside the carrier.
References
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Book

Numerical heat transfer and fluid flow

TL;DR: In this article, the authors focus on heat and mass transfer, fluid flow, chemical reaction, and other related processes that occur in engineering equipment, the natural environment, and living organisms.
Journal ArticleDOI

Enthalpy-porosity technique for modeling convection-diffusion phase change: application to the melting of a pure metal

TL;DR: In this article, the melting of pure gallium in a rectangular cavity has been numerically investigated using the enthalpy-porosity approach for modeling combined convection-diffusion phase change.
Proceedings ArticleDOI

Thermal modelling of the Pentium processor package

TL;DR: In this article, a component manufacturer and a thermal analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) are presented.
ReportDOI

An investigation of using a phase-change material to improve the heat transfer in a small electronic module for an airborne radar application

TL;DR: In this article, the energy equation is formulated in terms of enthalpy and discretized using a finite-difference method, which can be used to analyze heat conduction in a rectangular region undergoing an isothermal phase change.
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