Journal ArticleDOI
Application of phase change materials for passive thermal control of plastic quad flat packages (PQFP): a computational study
D. Pal,Yogendra Joshi +1 more
- Vol. 30, Iss: 1, pp 19-34
TLDR
In this paper, a transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB).Abstract:
A transient three-dimensional analysis was performed for passive thermal control of a plastic quad flat package (PQFP) by incorporating phase change material (PCM) under the printed wiring board (PWB). Governing conservation equations for mass, momentum and energy were solved by an implicit finite volume numerical technique. The effects of phase change were modelled by a single domain enthalpy-porosity technique. To study the effects of thermal conductivity of the board, a total of four cases were considered with two different board materials. It was found that passive cooling with PCM can arrest the temperature rise for a substantial time, for the power level considered. A higher board thermal conductivity resulted in a reduction in temperature levels. The melt region for a lower thermal conductivity of the board was found to be localized near the package footprint, while, for a higher board conductivity, the melt region extends along the board.read more
Citations
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Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods Maximum chip performance under peak permissible temperature limits may be achieved with the help of combined electrical and thermal simulation of VLSI circuits.
Massoud Pedram,Shahin Nazarian +1 more
TL;DR: In this article, the authors present a brief discussion of key sources of power dissipation and their temperature relation in CMOS VLSI circuits, and techniques for full-chip temperature calculation with special attention to its implications on the design of high-performance, low-power very large scale integration (VLSI) circuits.
Journal ArticleDOI
Graft Semi-Interpenetrating Polymer Network Phase Change Materials for Thermal Energy Storage
TL;DR: Graft semi-interpenetrating polymer networks (IPNs) out of poly(ethylene glycol), PEG8000-based polyurethane, and acrylic copolymers were synthesized for phase change applications as mentioned in this paper.
Journal ArticleDOI
Heat transfer - A review of 1996 literature
E. R. G. Eckert,Richard J Goldstein,W. E. Ibele,Terrence W. Simon,Thomas H. Kuehn,Paul J Strykowski,Kumar K. Tamma,Avram Bar-Cohen,Joachim Heberlein,Jane H. Davidson,John C. Bischof,Francis A Kulacki,Uwe Kortshagen +12 more
Journal ArticleDOI
Numerical simulation of a phase change material in a spherical capsule with a hollow fin
Zouhair Meghari,T. Bouhal,Mahjoub Benghoulam,Tarik El Rhafiki,El Mehdi El Khattabi,Hicham doghmi,Ouazzani Jamil Mohammed +6 more
TL;DR: In this article, a phase change material (PCM) with normal and hollow fin was used to increase the heat exchange area and compare the effect of the regular fin with hollow one at different angles, showing that the melting time is reduced 14 times in the case of PCM with hollow fin compared to a configuration without fins.
Journal ArticleDOI
Thermal Management of Blocks in a Channel Using Phase Change Material
TL;DR: In this paper, phase change material (PCM) is used in thermal management of an electronic device to absorb heat from the blocks during high power periods, and to maintain their temperature at an acceptable level.
References
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Book
Numerical heat transfer and fluid flow
TL;DR: In this article, the authors focus on heat and mass transfer, fluid flow, chemical reaction, and other related processes that occur in engineering equipment, the natural environment, and living organisms.
Journal ArticleDOI
Enthalpy-porosity technique for modeling convection-diffusion phase change: application to the melting of a pure metal
TL;DR: In this article, the melting of pure gallium in a rectangular cavity has been numerically investigated using the enthalpy-porosity approach for modeling combined convection-diffusion phase change.
Proceedings ArticleDOI
Thermal modelling of the Pentium processor package
H.I. Rosten,Ram S. Viswanath +1 more
TL;DR: In this article, a component manufacturer and a thermal analysis software vendor working together to construct and validate a thermal model of first-level packaging of a die (the Pentium processor) are presented.
ReportDOI
An investigation of using a phase-change material to improve the heat transfer in a small electronic module for an airborne radar application
TL;DR: In this article, the energy equation is formulated in terms of enthalpy and discretized using a finite-difference method, which can be used to analyze heat conduction in a rectangular region undergoing an isothermal phase change.