Journal ArticleDOI
Conventional and topologically optimized polymer manifolds for direct cooling of power electronics
Aniket Ajay Lad,Ashrit Tayade,Muhammad Jahidul Hoque,Yue Zhao,Juan Carlos Balda,William P. King,Nenad Miljkovic +6 more
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TLDR
In this article , the design, optimization, and thermal-hydraulic performance of polymer manifolds directing coolant to the base plate of multi-chip power modules are investigated using computational fluid dynamic (CFD) simulations.About:
This article is published in International Journal of Heat and Mass Transfer.The article was published on 2023-02-01. It has received 1 citations till now. The article focuses on the topics: Power (physics) & Electronics.read more
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Proceedings ArticleDOI
Topology Optimized Fin Designs for Base Plate Direct-Cooled Multi-Chip Power Modules
TL;DR: In this paper , a two-dimensional two-layer topology optimization algorithm is developed and used to optimize the thermal-hydraulic performance of the fin, with thermal performance mapped in terms of the device average temperatures along with the chip-to-chip temperature difference with pressure drop characterizing the hydraulic performance.
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Ultrawide-Bandgap Semiconductors: Research Opportunities and Challenges
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TL;DR: The UWBG semiconductor materials, such as high Al‐content AlGaN, diamond and Ga2O3, advanced in maturity to the point where realizing some of their tantalizing advantages is a relatively near‐term possibility.
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Heat sink optimization with application to microchannels
TL;DR: In this article, the equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow.
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Opportunities and Challenges in Very High Frequency Power Conversion
David J. Perreault,Jingying Hu,J.M. Rivas,Yehui Han,Olivia Leitermann,Robert C. N. Pilawa-Podgurski,Anthony D. Sagneri,Charles R. Sullivan +7 more
TL;DR: In this article, the scaling of magnetic component size with frequency is investigated, and it is shown that substantial miniaturization is possible with increased frequencies even considering material and heat transfer limitations.
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Performance and testing of thermal interface materials
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TL;DR: A state-of-the-art assessment on ‘thermal interface materials’, including fundamentals, materials used, their performance, and how interface resistance is measured is provided.
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