Design, Optimization, and Scaling of MEM Relays for Ultra-Low-Power Digital Logic
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Citations
Designing and Fabricating MEMS Cantilever Switches
Fabrication of Electrostatically Actuated MEMS Switch
Experimental Demonstration of Coupled Sub-Harmonic Injection Locked Oscillation in Micro-Electro-Mechanical Relays
References
Vibration problems in engineering
Design of ion-implanted MOSFET's with very small physical dimensions
Use of Negative Capacitance to Provide Voltage Amplification for Low Power Nanoscale Devices
A tutorial on geometric programming
Related Papers (5)
Frequently Asked Questions (19)
Q2. What are the future works mentioned in the paper "Design, optimization, and scaling of mem relays for ultra-low-power digital logic" ?
M. A. Horowitz, E. Alon, D. Patil, S. Naffziger, R. Kumar, and K. Bernstein, “ Scaling, power, and the future of CMOS, ” in IEDM Tech. In 1992, she joined the Xerox Palo Alto Research Center, Palo Alto, CA, as a Member of the research staff, where she worked on the research and development of polycrystalline-silicon thin-film transistor technologies for high-performance flat-panel displays.
Q3. What is the way to optimize a relay?
Much like transistor scaling, relay miniaturization leads to dramatic improvements in density (for lower cost perfunction), switching delay (for higher performance), and energy efficiency.
Q4. What is the optimal dimple gap thickness to actuation gap ratio?
For a given contact dimple gap thickness, the optimal dimple-gap thickness to actuation-gap thickness ratio is roughly 0.7, meaning that pull-in operation is preferred for energy-efficient relay design.
Q5. How many T relays have been demonstrated using conventional surface micromachining processes?
Using ANSYS, γf and γt are found to be 3.66 and14T relays have been demonstrated using conventional surface micromachining processes [10].
Q6. How many beams are supported to the substrate?
The gate electrode is supported by four suspended beams (with an effective spring constant keff ) anchored to the substrate at four corners.
Q7. What is the optimum gate capacitance for a CMOS circuit?
In fact, the International Technology Roadmap for Semiconductors (ITRS) [40] predicts that the gate capacitance will only decrease by ∼2.5× as the transistor physical gate length is scaled from 38 to 7.4 nm.
Q8. What is the effect of the actuation area on the relay design?
This means that relay designs with lower beam stiffness, smaller contact dimple gap thickness, and therefore lower actuation area and supply voltage are feasible if a smaller contact dimple area is utilized.
Q9. What is the effect of surface-related energy loss mechanisms on tdelay?
the quality factor of nanometer-scale logic relays will be dominated by surface-related energy-loss mechanisms, due to their relatively large surface-to-volume ratio.
Q10. Why is the minimum device width scaling so slow?
due to increasing variability, the minimum device width has been scaling relatively slowly and leading to minimal reduction in CMOS.
Q11. How many times would the physical gate length be scaled down to below 5 nm?
(28)Assuming ideal MOSFET scaling and constant operating temperature, Vddopt,MOS remains relatively constant, and hence, the minimum energy of CMOS scales linearly by the factor S. Based on Fig. 21, the physical gate length would need to be scaled down by approximately 20 times (i.e., to below 5 nm) to match the minimum energy potentially achievable with relays.
Q12. What is the optimum supply voltage for a CMOS circuit?
As derived in [6] and [32], the optimum supply voltage is proportional to the thermal voltageVddopt,MOS ∝ n × kBT/q (27)where n ≈ 1.2 is the subthreshold factor [6], [32].
Q13. Where is the optimal beam length for a low-Q relay?
From (23), for a low-Q relay with κ ≈ −0.34 and Vnorm ≈ 1.17−1.29, the optimal Cnorm ranges from 0.74 to 0.13; for a high-Q relay with κ ≈ −0.4 and Vnorm ≈ 1.17−1.29, the optimal Cnorm ranges from 0.97 to 0.27.7
Q14. How can FA be extracted from the measurements of Vpi and Vrl?
FA can be extracted from the measurementsof Vpi and Vrl for devices of various beam lengths, according to the following equation [derived from (1)]:V 2rl = 27 4 gd g( 1 − gdg)2 V 2pi −2(g − gd)2 εoA FA. (3)FA is extracted to be 0.45 μN on average for TiO2-coated tungsten electrodes with a contact dimple area (Ad) of 2 × 10 μm2, as shown in Fig.
Q15. What is the effective spring constant of the movable structure?
Vrl =√ 2(keffgd − FA)(g − gd)2εoA (1)where keff is the effective spring constant of the movable structure and A is the actuation area (≈ LA × WA, ignoring release etch holes).
Q16. What is the optimal supply voltage of a 32-bit adder?
As discussed in [39], due to this effect, the optimal supplyvoltage of a 32-bit adder increases from ∼0.25 to ∼0.33 V from the 65- to 32-nm technology nodes.
Q17. How is the energy efficiency of a relay optimized?
As will be derived in the following section, the energy efficiency of a relay is optimized by operating it in pull-in mode, i.e., designing it such that gd > g/3.
Q18. What is the effect of a squeeze film on the actuation gap?
In contrast, for scaled logic relays with actuation gaps approaching 10 nm, i.e., less than the mean free path of an air molecule, squeeze-film damping will be negligible.
Q19. What is the voltage between the movable gate electrode and the fixed body electrode?
The voltage applied between the movable gate electrode and the fixed body electrode determines whether current can flow between the source and drain electrodes.