Journal ArticleDOI
Effects of barrier layer and annealing on abnormal grain growth in copper thin films
TLDR
In this article, a bimodal grain size distribution was observed at annealing temperatures at or above 150°C for Cu on Ta and 100°C on W. The results are explained as the result of competition between strain energy minimization and surface and interface energy minimisation.Abstract:
Abnormal (100) grain growth has been characterized in predominantly (111)‐textured Cu thin films as a function of deposition temperature, annealing temperature and the presence of a Ta or W underlayer. For films deposited at room temperature, bimodal grain size distributions are observed at annealing temperatures at or above 150 °C for Cu on Ta and 100 °C for Cu on W. Suppression of (100) abnormal grain growth was achieved by depositing Cu on either barrier layer at 150 °C. A bimodal grain size distribution was still observed for the film deposited on W at 150 °C but the large grains forming this distribution were found to be (111) oriented. These results are explained as the result of competition between strain energy minimization and surface and interface energy minimization. The (100) growth is shown to be driven by a reduction of the orientation‐dependent strain energy that builds up due to the elastic anisotropy of Cu. Films deposited at higher temperatures have a lower yield stress which limits the ...read more
Citations
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Journal ArticleDOI
Structure Evolution During Processing of Polycrystalline Films
TL;DR: In this article, general trends in structural evolution in polycrystalline films, as a function of processing conditions and materials class, are discussed in terms of these fundamental kinetic processes.
Journal ArticleDOI
The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films
Jerrold A. Floro,Sean J. Hearne,John A. Hunter,Paul G. Kotula,Eric Chason,Steven C. Seel,Carl V. Thompson +6 more
TL;DR: In this article, real-time measurements of stress evolution during the deposition of Volmer-Weber thin films reveal a complex interplay between mechanisms for stress generation and stress relaxation.
Journal ArticleDOI
Physical Origins of Intrinsic Stresses in Volmer–Weber Thin Films
TL;DR: In this paper, the fundamental mechanisms that can generate stresses during the growth of Volmer-Weber thin films are reviewed, including surface-stress effects and flux-driven incorporation of excess atoms within grain boundaries.
Journal ArticleDOI
Thermal Properties of Graphene–Copper–Graphene Heterogeneous Films
Pradyumna Goli,Hao Ning,Xuesong Li,Ching Yu Lu,Konstantin S. Novoselov,Alexander A. Balandin +5 more
TL;DR: It is demonstrated experimentally that graphene-Cu-graphene heterogeneous films reveal strongly enhanced thermal conductivity as compared to the reference Cu and annealed Cu films.
Journal ArticleDOI
Thermal strain and stress in copper thin films
TL;DR: In this paper, the behavior of copper films is evaluated to determine effects of film texture, thickness, and the presence of a passivation layer, and an inverse relationship between film thickness and strength is quantified.
References
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Book
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TL;DR: In this article, the authors discuss the properties of phase diagrams for single-component systems, including the influence of interfaces on the equilibrium of binary solutions in Heterogeneous Systems (Heterogeneous Binary Phase Diagrams).
Journal ArticleDOI
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Journal ArticleDOI
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TL;DR: In this paper, the mechanisms and modes of grain growth in thin films are reviewed and the focus is on those factors that lead to the evolution of grain orientations as well as grain siamese expressions.
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The yield stress of polycrystalline thin films
TL;DR: In this paper, it has been shown that the yield stress of polycrystalline thin films depends separately on the film thickness and the grain size, and that grain size dependence varies as the reciprocal of the grain sizes.