Journal ArticleDOI
On-chip cooling by superlattice-based thin-film thermoelectrics
Ihtesham Chowdhury,Ravi Prasher,Ravi Prasher,Kelly Lofgreen,Gregory M. Chrysler,Sridhar Narasimhan,Ravi Mahajan,David A. Koester,Randall G. Alley,Rama Venkatasubramanian +9 more
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TLDR
This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.Abstract:
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.read more
Citations
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Journal ArticleDOI
Thermoelectric hotspot cooling using thermally conductive fillers
Sangjun Park,Junyoung Park,Ki Mun Bang,Jung Min Lee,Woosung Park,Piotr Ziółkowski,Hyun-Chul Jin +6 more
TL;DR: In this paper , a filler-embedded thermoelectric cooler (F-TEC) is proposed to improve the cooling capability of the TEC by using a thermally conductive filler material.
Dissertation
Enhancing thermoelectric performance of graphene through nanostructuring
TL;DR: In this article, the authors present a Table of Table of Contents for KnowLEDGEMENT in the context of knowledge discovery. ___________________________________________________________________________________________________________ ____________________________________________________________________________________________________________________________________________ ________________________________________________________________________
Journal ArticleDOI
A Strategy to Reduce the Peak Temperature of the Chip Working under Dynamic Power Using the Transient Cooling Effect of the Thin-Film Thermoelectric Cooler
Journal ArticleDOI
Nanostructure and thermal power of highly-textured and single-crystal-like Bi2Te3 thin films
Heng Zhang,Jamo Momand,Joshua Levinsky,Qikai Guo,Xiaotian Zhu,Gert H. ten Brink,Graeme R. Blake,George Palasantzas,Bart J. Kooi +8 more
TL;DR: In this paper, a detailed analysis of the atomic and nano-scale structure of Bi2Te3 thin film in relation to their thermoelectric properties remains poorly explored, and the measured properties are correlated with the atomic structure details unveiled by scanning transmission electron microscopy.
Nanoparticles for heat transfer enhancement in microfluidic systems
TL;DR: In this paper, the problem of cooling hot spots, which are generated during the operation of these electronic systems, is discussed, without any proper thermal control, and without proper thermal modeling.
References
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Journal ArticleDOI
Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Journal ArticleDOI
High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys
Bed Poudel,Qing Hao,Yi Ma,Yucheng Lan,Austin J. Minnich,Bo Yu,Xiao Yan,Dezhi Wang,Andrew Muto,Daryoosh Vashaee,Xiaoyuan Chen,Jun-Ming Liu,Mildred S. Dresselhaus,Gang Chen,Zhifeng Ren +14 more
TL;DR: Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects, which makes these materials useful for cooling and power generation.
Journal Article
High Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys.
Bed Poudel,Qing Hao,Yi Ma,Austin J. Minnich,Andrew Muto,Yucheng Lan,Bo Yu,Xiao Yan,Dezhi Wang,Daryoosh Vashaee,X.Y. Chen,Dresselhaus,Gang Chen,Zhifeng Ren +13 more
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
BookDOI
CRC Handbook of Thermoelectrics
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.