Journal ArticleDOI
On-chip cooling by superlattice-based thin-film thermoelectrics
Ihtesham Chowdhury,Ravi Prasher,Ravi Prasher,Kelly Lofgreen,Gregory M. Chrysler,Sridhar Narasimhan,Ravi Mahajan,David A. Koester,Randall G. Alley,Rama Venkatasubramanian +9 more
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TLDR
This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.Abstract:
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.read more
Citations
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Journal ArticleDOI
Hotspot management using a hybrid heat sink with stepped pin-fins
Danish Ansari,Kwang-Yong Kim +1 more
TL;DR: In this article, a hybrid heat sink design with microchannels and stepped pin-fins is introduced for hotspot-targeted thermal management of microprocessors, and the thermal and hydraulic performance were assessed.
Journal ArticleDOI
Bias-Compensated Least Squares Identification of Distributed Thermal Models for Many-Core Systems-on-Chip
TL;DR: This work proposes a novel distributed identification strategy to derive distributed interacting thermal models that can cope with both process noise and temperature sensor noise affecting inputs and outputs of the adopted models.
Journal ArticleDOI
Unraveling the dislocation core structure at a van der Waals gap in bismuth telluride.
TL;DR: In this paper, the authors used atomic-resolution electron microscopy and simulations to image a dislocation core in bismuth telluride and show it spreads because of weak bonding between atomic layers.
Journal ArticleDOI
Thermoelectric properties of copper chalcogenide alloys deposited via the solution-phase using a thiol–amine solvent mixture
TL;DR: In this article, the first thermoelectric properties measurements on metal chalcogenide thin films made in this manner were reported. But the results were limited to the case of polysilicon.
Journal ArticleDOI
An effective method of evaluating the device-level thermophysical properties and performance of micro-thermoelectric coolers
TL;DR: In this article, the authors developed a method for the effective evaluation of the device-level thermophysical properties capturing various interfacial and size effects, and established a three-dimensional numerical model to evaluate the cooling performance of micro-thermoelectric coolers.
References
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Journal ArticleDOI
Thin-film thermoelectric devices with high room-temperature figures of merit
TL;DR: Th thin-film thermoelectric materials are reported that demonstrate a significant enhancement in ZT at 300 K, compared to state-of-the-art bulk Bi2Te3 alloys, and the combination of performance, power density and speed achieved in these materials will lead to diverse technological applications.
Journal ArticleDOI
High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys
Bed Poudel,Qing Hao,Yi Ma,Yucheng Lan,Austin J. Minnich,Bo Yu,Xiao Yan,Dezhi Wang,Andrew Muto,Daryoosh Vashaee,Xiaoyuan Chen,Jun-Ming Liu,Mildred S. Dresselhaus,Gang Chen,Zhifeng Ren +14 more
TL;DR: Electrical transport measurements, coupled with microstructure studies and modeling, show that the ZT improvement is the result of low thermal conductivity caused by the increased phonon scattering by grain boundaries and defects, which makes these materials useful for cooling and power generation.
Journal Article
High Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys.
Bed Poudel,Qing Hao,Yi Ma,Austin J. Minnich,Andrew Muto,Yucheng Lan,Bo Yu,Xiao Yan,Dezhi Wang,Daryoosh Vashaee,X.Y. Chen,Dresselhaus,Gang Chen,Zhifeng Ren +13 more
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
BookDOI
CRC Handbook of Thermoelectrics
TL;DR: In this article, Rowe et al. proposed a method for reducing the thermal conductivity of a thermoelectric generator by reducing the carrier concentration of the generator, which was shown to improve the generator's performance.